William Richard Dennis

US Patent:

6806993, Oct 19, 2004

Filed:

Jun 4, 2003

Appl. No.:

10/454075

Inventors:

Lea Adams - Plano TX
Edward C. Fisher - Lucas TX
Josh Malone - Plano TX
Seth Miller - Sachse TX
Jack C. Smith - Parker TX
William Kevin Dennis - Garland TX
Jeffrey W. Marsh - Murphy TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G02B 2600

US Classification:

359291, 354290, 438106

Abstract:

The present invention provides, in one aspect, a method of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate. The method further includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes lubricating/passivating the MEMS device through the opening. In addition, a MEMS assembly constructed according to a process of the present invention is also disclosed.

US Patent:

60206306, Feb 1, 2000

Filed:

Jan 5, 1995

Appl. No.:

8/368926

Inventors:

William K. Dennis - Garland TX
Masood Murtuza - Sugarland TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 2348
H01L 2350
H01L 2952

US Classification:

257690

Abstract:

A semiconductor package (80) is provided that serves to support a semiconductor chip (12). A radial slot (54) is formed in an inner ring (26). Cross-slots (64) and (66) are formed in a corner member (38) of polyimide film (22). The slots (54), (64) and (66) serve to allow independent expansion of various portions of the polyimide film (22) and prevent breakage of contact leads (14), (16), (18) and (20) due to the differences in the thermal coefficient of expansion of the semiconductor material and the polyimide film material.

US Patent:

56619006, Sep 2, 1997

Filed:

Mar 7, 1994

Appl. No.:

8/206814

Inventors:

Robert N. McLellan - Garland TX
Anthony M. Chiu - Richardson TX
Paul J. Hundt - Garland TX
William K. Dennis - Garland TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01R 4300

US Classification:

29827

Abstract:

A method of fabricating a semiconductor device comprising the steps of providing an encapsulated semiconductor device bonded to a lead frame, providing a support ring formed of a material which softens when subjected to one of ultrasonic energy or formed of a material which softens when subjected to heat insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame, preferably thermoplastic and preferably polyphenylene sulfide, disposing leads of said lead frame over said support ring and causing said leads to embed in said support ring by applying ultrasonic energy to said support ring or by applying heat to said support ring insufficient to cause sufficient expansion of said lead frame relative to said support ring to cause buckling of the leads of said lead frame. The lead frame is preferably formed of gold plated copper, solder plate or tin plate.

US Patent:

6177040, Jan 23, 2001

Filed:

Nov 24, 1993

Appl. No.:

8/157580

Inventors:

William K. Dennis - Garland TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B29C 3502
B29C 7070
B29C 7074

US Classification:

26427213

Abstract:

A light transparent package (50) for an erasable integrated circuit (12), and a method for fabricating it are disclosed. The package (50) encapsulates a leadframe (14) that carries the circuit (12). The circuit (12) is an erasable integrated circuit, including an erasable programmable read only memory device. A light transparent window material (18) immiscible in molding compound (34) is emplaced conformally on a surface (30) of the circuit (12). The window material (18) is a gel, polymer preform, or other suitable conformal window forming material adherable to both the circuit (12) and to other components of the assembly, and is transparent to light, particularly ultraviolet light, following a curing process. The molding compound (34) and window material (18) are cured in situ in a cavity (22) of a mold (20). The cavity (22) has at least one contact surface (26) that compresses the window material 18 to form a flattened surface (32) between the window material 18 and the contact surface (26) of the cavity (22).