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William David Hopfe

age ~65

from Farmington Hills, MI

Also known as:
  • William D Hopfe
  • William B Hopfe
  • Bill D Hopfe
  • Bill M Hopfe
  • William D Hoppe
  • Willian Hoppe
Phone and address:
35730 Fredericksburg Rd, Farmington, MI 48331
(248)5538449

William Hopfe Phones & Addresses

  • 35730 Fredericksburg Rd, Farmington, MI 48331 • (248)5538449
  • Farmington Hills, MI
  • Longmeadow, MA
  • 63 Homestead Rd, Holden, MA 01520 • (508)8292300
  • Tolland, CT
  • Willimantic, CT

Us Patents

  • High Frequency Antenna Disposed On The Surface Of A Three Dimensional Substrate

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  • US Patent:
    7015869, Mar 21, 2006
  • Filed:
    Nov 18, 2002
  • Appl. No.:
    10/298434
  • Inventors:
    C. Allen Marlow - Saline MI, US
    Jay DeAvis Baker - West Bloomfield MI, US
    Lawrence Leroy Kneisel - Novi MI, US
    Rosa Lynda Nuño - Berkley MI, US
    William David Hopfe - Farmington Hills MI, US
  • Assignee:
    Visteon Global Technologies, Inc. - Van Buren Township MI
  • International Classification:
    H01Q 19/00
  • US Classification:
    343850, 333246, 333247, 257664, 174266
  • Abstract:
    The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.
  • Engine Combustion Monitoring And Control With Integrated Cylinder Head Gasket Combustion Sensor

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  • US Patent:
    20030074957, Apr 24, 2003
  • Filed:
    Aug 28, 2002
  • Appl. No.:
    10/230485
  • Inventors:
    Myron Lemecha - Dearborn MI, US
    Jay Baker - West Bloomfield MI, US
    Achyuta Achari - Canton MI, US
    William Hopfe - Farmington Hills MI, US
    Lakhi Goenka - Ann Arbor MI, US
  • Assignee:
    Visteon Global Technologies, Inc.
  • International Classification:
    G01M019/00
  • US Classification:
    073/118100
  • Abstract:
    An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.
  • Selective Soldering Of Flat Flexible Cable With Lead-Free Solder To A Substrate

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  • US Patent:
    20060226199, Oct 12, 2006
  • Filed:
    Mar 30, 2005
  • Appl. No.:
    11/093449
  • Inventors:
    Zhong-You Shi - Ann Arbor MI, US
    Prathap Reddy - Farmington Hills MI, US
    Anne Sullivan - Dearborn MI, US
    William Hopfe - Farmington Hills MI, US
  • International Classification:
    A47J 36/02
  • US Classification:
    228101000
  • Abstract:
    A system and method for soldering flat flexible cable to an electronic substrate using lead-free solder is disclosed. The method comprises bending conductive end portions of the flat flexible cable and inserting the bent conductive end portions of the flat flexible cable through slots that extend through the thickness of the electronic substrate. In so doing, a segment of the conductive end portion will protrude through the thickness of the substrate. The method further comprises of heating the flat flexible cable to a temperature of approximately 100 C. and then applying the lead-free solder to the area where the end portion protrudes through the thickness of the substrate for a time period of approximately 5 to 9 seconds.
Name / Title
Company / Classification
Phones & Addresses
William D. Hopfe
President
POLYSTRESS, INC
65 Pioneer Dr, Longmeadow, MA

Classmates

William Hopfe Photo 1

Longmeadow High School, L...

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Graduates:
Bill Hopfe (1973-1977),
Jonathan Barr (1996-2000)

Mylife

William Hopfe Photo 2

William Hopfe Waianae HI

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