Woojin Jin Kim

US Patent:

8002315, Aug 23, 2011

Filed:

Dec 23, 2009

Appl. No.:

12/645972

Inventors:

Brian Allen Engle - Armada MI, US
Woojin Kim - Irvine CA, US
George Szabo - Ortonville MI, US

Assignee:

General Electric Corporation - Schenectady NY

International Classification:

F16L 37/00

US Classification:

285305, 137557

Abstract:

There is provided embodiments of a fluid fitting, and system incorporating the fluid fitting therein, which is compatible with harsh, caustic environments such as those environments found in the automotive industry. In one embodiment, the fluid fitting can comprise a conductive element with a fluid pathway for transporting a fluid, e. g. , fuel. The fluid fitting can also comprise a non-conductive element that is coupled to the conductive element in a manner discharging electrons from the conductive body. The non-conductive element can comprise a cavity with an opening exposing a sensing device with a sensing element disposed on a sensing element housing. The sensing element housing can be sealed to the conductive element, but expose the sensing element to the fluid in the fluid pathway.

US Patent:

8264074, Sep 11, 2012

Filed:

Sep 10, 2010

Appl. No.:

12/879143

Inventors:

Woojin Kim - Irvine CA, US
Aniela Bryzek - Hayward CA, US
John Dancaster - Fremont CA, US
Dong-Suk Kim - Hwasung-shi, KR

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 23/535

US Classification:

257686, 257680, 257685, 257784, 257E23128, 257E23169, 438109

Abstract:

A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e. g. , wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.