Woojin Kim

US Patent:

8264074, Sep 11, 2012

Filed:

Sep 10, 2010

Appl. No.:

12/879143

Inventors:

Woojin Kim - Irvine CA, US
Aniela Bryzek - Hayward CA, US
John Dancaster - Fremont CA, US
Dong-Suk Kim - Hwasung-shi, KR

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 23/535

US Classification:

257686, 257680, 257685, 257784, 257E23128, 257E23169, 438109

Abstract:

A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e. g. , wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.