Skills:
Au-Sn Solder, Epoxy Dispense, Eutectic Die Bond, Flip-Chip, Hand Assembly, Hot Gas Rework. Parallel Gap Welding, Plasma Cleaning, Resistor Trim, SAC Solder, Screen Printing, Seam Sealing, Solder Reflow, Stud Bumping, Thermocompression Bonding. Vacuum Baking, Wafer Dicing, Wire Bond, Centrifuge, Failure Analysis, Leak Detection, PIND Testing, Pull Testing, Shear Testing, AOI, Metallurgy , Die Probe, Calibration, AFM, Auger Microprobe, FIB, Microscopy, SEM, EDS, XPS, XRD, Interferometry, LTCC, Electronics Packaging, Hybrid Microelectronics, Six Sigma, Lean Manufacturing, CAD