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Xuefeng F Zeng

age ~45

from Santa Clara, CA

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Also known as:
  • Zeng Xuefeng
Related to:
Connected to:

Xuefeng Zeng Phones & Addresses

  • Santa Clara, CA
  • Dublin, CA
  • Schenectady, NY
  • Clifton Park, NY
  • San Jose, CA
  • Seattle, WA
  • Madison, WI

Work

  • Company:
    Globalfoundries us inc
    Oct 2012
  • Position:
    Senior engineer

Education

  • School / High School:
    University of Wisconsin - Madison- Madison, WI
    Jan 2005
  • Specialities:
    PhD in Electrical Engineering

Skills

Microfabrication CMOS and MEMS semicondu... • Electroplating • Thin film and bulk micromachining • Lithography • PECVD • LPCVD • Oxidation • RIE • DRIE (ICP) • Sputter • Evaporation • Dry and wet etching • wiring-bond • etc. Characterization SEM • AFM • XPS • AES • FTIR • Spectrometer • Profiler • Stereomicroscope • Goniometer • Microscope • White-light interferometer • Four-probe measurement • etc. Design and Modeling ANSYS • CFD-RC • CoventorWare • Zemax • Solidworks • Autodesk 3ds Max • L-Edit • Hspice • Labview • Matlab • C+ • VHDL and Verilog language • etc. Electronics & Mechanics Optical... • Circuit control and programming (C+ lang... • PCB design and fabrication • etc. Microfluidics Pressure and temperat... • Liquid interface manipulation • Surface treatment • Polymer and silicon channels • etc. Optics Fiber endoscope design and i... • Optical systems design and imaging • Optical system aberration • etc.

Languages

English • Mandarin

Interests

Microfluidics • Economic Empowerment • Health • Education • Environment • Integration and Yield Analysis • Science and Technology • Arts and Culture • Optics and Phontonics • Mems Design and Fabrication • Engineer With Innovation • Problem and Solution Analysis

Industries

Computer Software

Resumes

Xuefeng Zeng Photo 1

Application Consultant

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Location:
4211 Burton Dr, Santa Clara, CA 95054
Industry:
Computer Software
Work:
Globalfoundries US Inc. - Malta NY since Sep 2012
Senior Engineer
Hermes Microvision Inc. - San Jose, CA Oct 2011 - Sep 2012
Senior Application Engineer
Institute for Systems Biology Jan 2011 - Oct 2011
Research Associate
University of Wisconsin-Madison Sep 2009 - Dec 2010
Postdoctoral Research Associate
Education:
University of Wisconsin-Madison 2005 - 2009
Ph.D., Electrical Engineering Tsinghua University 2002 - 2005
MS, Microelectronics & Solid State Electronics Tianjin University 1998 - 2002
BS, Microelectronics & Solid State Electronics
Skills:
Mems
Optics
Microfabrication
Electronics
Microfluidics
Design of Experiments
Characterization
Simulations
R&D
Semiconductors
Nanotechnology
Matlab
Silicon
Thin Films
Process Simulation
Photonics
Medical Devices
Laser
Semiconductor Process
Spc
Yield Management
Defect Elimination
Ebeam Inspection
Semiconductor Failure Analysis
Project Management
Sensors
Ansys
Metrology
Interests:
Microfluidics
Economic Empowerment
Health
Education
Environment
Integration and Yield Analysis
Science and Technology
Arts and Culture
Optics and Phontonics
Mems Design and Fabrication
Engineer With Innovation
Problem and Solution Analysis
Languages:
English
Mandarin
Xuefeng Zeng Photo 2

Xuefeng Zeng Seattle, WA

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Work:
Globalfoundries US Inc

Oct 2012 to 2000
Senior Engineer Hermes Microvision Inc.
San Jose, CA
Oct 2011 to Oct 2012
Senior Application Engineer Institute for Systems Biology
Seattle, WA
Jan 2011 to Sep 2011
Postdoctoral Fellow Micro-Nano Sensors and Actuators Lab, University of Wisconsin
Madison, WI
Sep 2009 to Dec 2010
Postdoctoral Research Associate
Education:
University of Wisconsin - Madison
Madison, WI
Jan 2005 to Jan 2009
PhD in Electrical Engineering University of Wisconsin - Madison
Madison, WI
Jan 2005 to Jan 2007
MS in Electrical Engineering Tsinghua University
Jan 2002 to Jan 2005
MS in Microelectronics & Solid State Electronics Tianjin University
Jan 1998 to Jan 2002
Master in Microelectronics & Solid State Electronics
Skills:
Microfabrication CMOS and MEMS semiconducotr process, Electroplating, Thin film and bulk micromachining, Lithography, PECVD, LPCVD, Oxidation, RIE, DRIE (ICP), Sputter, Evaporation, Dry and wet etching, wiring-bond, etc. Characterization SEM, AFM, XPS, AES, FTIR, Spectrometer, Profiler, Stereomicroscope, Goniometer, Microscope, White-light interferometer, Four-probe measurement, etc. Design and Modeling ANSYS, CFD-RC, CoventorWare, Zemax, Solidworks, Autodesk 3ds Max, L-Edit, Hspice, Labview, Matlab, C+, VHDL and Verilog language, etc. Electronics & Mechanics Optical mounting device design and machining, Circuit control and programming (C+ language), PCB design and fabrication, etc. Microfluidics Pressure and temperature control, Liquid interface manipulation, Surface treatment, Polymer and silicon channels, etc. Optics Fiber endoscope design and integration, Optical systems design and imaging, Optical system aberration, etc.

Us Patents

  • Systematic Defects Inspection Method With Combined Ebeam Inspection And Net Tracing Classification

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  • US Patent:
    20160306009, Oct 20, 2016
  • Filed:
    Apr 17, 2015
  • Appl. No.:
    14/689088
  • Inventors:
    - Grand Cayman, KY
    Xuefeng ZENG - Niskayuna NY, US
    Yan PAN - Clifton Park NY, US
    Peter LIN - Ballston Lake NY, US
    Hoang NGUYEN - Saratoga Springs NY, US
    Ho Young SONG - Clifton Park NY, US
  • International Classification:
    G01R 31/305
  • Abstract:
    A method and apparatus for separating real DVC via defects from nuisance based on Net Tracing Classification of eBeam VC die comparison inspection results are provided. Embodiments include performing an eBeam VC die comparison inspection on each via of a plurality of dies; determining DVC vias based on the comparison; performing a Net Tracing Classification on the DVC vias; determining S/D DVC vias based on the Net Tracing Classification; and performing a die repeater analysis on the S/D DVC vias to determine systematic design-related DVC via defects.

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Xuefeng Zeng Photo 3

Xuefeng Zeng

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