Yakov Bobrov

US Patent:

20130271596, Oct 17, 2013

Filed:

Feb 27, 2013

Appl. No.:

13/779062

Inventors:

Yakov Bobrov - Burlingame CA, US

Assignee:

KLA-TENCOR CORPORATION - Milpitas CA

International Classification:

G01N 21/88

US Classification:

348126

Abstract:

The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

US Patent:

61114200, Aug 29, 2000

Filed:

Feb 25, 1998

Appl. No.:

9/030007

Inventors:

Mark P. Kelley - San Jose CA
Yakov A. Bobrov - San Francisco CA

Assignee:

Cirrus Logic, Inc. - Fremont CA

International Classification:

G01R 3102

US Classification:

324755

Abstract:

The apparatus of the present invention includes a frame for attaching the clamp of a hand test socket to a workpress assembly of a high-speed IC handler. The frame attaches to a workpress assembly. Utilizing the clamp of a test socket recycles frequently unused test socket parts and eliminates the need for custom fabricated workpress assembly components. The method for adapting the hand test socket for use on the workpress assembly includes the steps: providing a test socket having a base and a top cover, the top cover including a clamp; removing the top cover and the clamp; configuring the clamp for use in a workpress assembly; and attaching the clamp to the workpress assembly.

US Patent:

60182482, Jan 25, 2000

Filed:

Apr 29, 1997

Appl. No.:

8/845943

Inventors:

Mark P. Kelley - San Jose CA
Yakov A. Bobrov - San Francisco CA

Assignee:

Cirrus Logic, Inc. - Fremont CA

International Classification:

G01R 3102

US Classification:

324755

Abstract:

A frame for holding a bladed element of a test socket is used in an IC handling system. The frame includes a face, a rim formed on the face, a detent formed on the rim so that the rim and the detent are capable of holding the bladed element. The detent includes a hook having a beveled edge for holding the bladed element.

US Patent:

60197161, Feb 1, 2000

Filed:

Jul 13, 1998

Appl. No.:

9/114616

Inventors:

Sean Forestell - San Jose CA
Robert J. Tushinski - Mountain View CA
Richard J. Rigg - Mountain View CA
Yakov Bobrov - San Francisco CA

Assignee:

Novartis AG - Basel

International Classification:

B04B 502

US Classification:

494 21

Abstract:

A device is provided for use in a centrifuge to separate or isolate material (such as pelleted cells, particulates, aggregates, compounds, blood components, and the like) from the liquid in which they are suspended while limiting or preventing loss of any of the resulting separated or pelleted material during further manipulations. The device can be inserted into a standard centrifugation bucket in a centrifuge and holds a flexible centrifuge bag. The device includes at least one damp assembly, which includes a partition that is maintained in an open position during centrifugation and in a closed position at unit gravity, thus isolating separated or pelleted material at the bottom of the flexible bag in the device after centrifugation and preventing the isolated material from being disturbed during liquid changes and other manipulations. The invention also encompasses a method for isolating material in a centrifuge bag following centrifugation utilizing the flexible bag-holding device described herein, as well as a flexible bag to be used with the device.

US Patent:

59241837, Jul 20, 1999

Filed:

Apr 29, 1997

Appl. No.:

8/846932

Inventors:

Mark P. Kelley - San Jose CA
Yakov A. Bobrov - San Francisco CA

Assignee:

Cirrus Logic, Inc. - Fremont CA

International Classification:

B21K 2300

US Classification:

294011

Abstract:

A method of adapting a hand test socket for use in a workpress assembly includes: providing a hand test socket having a base and a top cover. The top cover includes a clamp. The method includes the step: removing the top cover and the clamp and configuring the clamp for use in a workpress assembly. The step of configuring the clamp includes forming a frame and attaching the clamp to the frame.

US Patent:

58699767, Feb 9, 1999

Filed:

Dec 13, 1996

Appl. No.:

8/764965

Inventors:

Mark P. Kelley - San Jose CA
Yakov A. Bobrov - San Francisco CA

Assignee:

Cirrus Logic, Inc. - Fremont CA

International Classification:

G01R 3102

US Classification:

324755

Abstract:

The apparatus of the present invention includes a frame for attaching the clamp of a hand test socket to a workpress assembly of a high-speed IC handler. The frame attaches to a workpress assembly. Utilizing the clamp of a test socket recycles frequently unused test socket parts and eliminates the need for custom fabricated workpress assembly components. The method for adapting the hand test socket for use on the workpress assembly includes the steps: providing a test socket having a base and a top cover, the top cover including a clamp; removing the top cover and the clamp; configuring the clamp for use in a workpress assembly; and attaching the clamp to the workpress assembly.

US Patent:

20210098228, Apr 1, 2021

Filed:

Dec 10, 2020

Appl. No.:

17/117696

Inventors:

- Hillsboro OR, US
Seema SOMANI - San Jose CA, US
Cecelia CAMPOCHIARO - Sunnyvale CA, US
Yakov BOBROV - Burlingame CA, US

International Classification:

H01J 37/302
G01N 23/2257
H01J 37/26
G01R 31/265
G01R 31/27
H01J 37/304
H01J 37/305
G01R 31/28
G01R 31/26

Abstract:

Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.

US Patent:

20190287762, Sep 19, 2019

Filed:

Jan 22, 2019

Appl. No.:

16/253786

Inventors:

- Hillsboro OR, US
Seema SOMANI - San Jose CA, US
Cecelia CAMPOCHIARO - Sunnyvale CA, US
Yakov BOBROV - Burlingame CA, US

International Classification:

H01J 37/302
G01N 23/2257
H01J 37/26

Abstract:

Described herein are a system and method of preparing integrated circuits (ICs) so that the ICs remain electrically active and can have their active circuitry probed for diagnostic and characterization purposes using charged particle beams. The system employs an infrared camera capable of looking through the silicon substrate of the ICs to image electrical circuits therein, a focused ion beam system that can both image the IC and selectively remove substrate material from the IC, a scanning electron microscope that can both image structures on the IC and measure voltage contrast signals from active circuits on the IC, and a means of extracting heat generated by the active IC. The method uses the system to identify the region of the IC to be probed, and to selectively remove all substrate material over the region to be probed using ion bombardment, and further identifies endpoint detection means of milling to the required depth so as to observe electrical states and waveforms on the active IC.