Yan F Fang

US Patent:

8075701, Dec 13, 2011

Filed:

Jun 30, 2008

Appl. No.:

12/164294

Inventors:

Armen Avoyan - Glendale CA, US
Yan Fang - Fremont CA, US
Duane Outka - Fremont CA, US
Hong Shih - Walnut CA, US
Stephen Whitten - Danville CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

C23G 1/00
B08B 3/00
H01L 21/00

US Classification:

134 26, 134 2, 134 3, 438 4

Abstract:

A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive backing plate is provided. The process comprises: (i) removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising sulfuric acid, hydrogen peroxide, and water and rinsing the multi-component electrode with de-ionized water; (ii) polishing one or more surfaces of the multi-component electrode following removal of metal ions there from; and (iii) removing contaminants from silicon surfaces of the multi-component electrode by treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water. Additional embodiments of broader and narrower scope are contemplated.

US Patent:

8143904, Mar 27, 2012

Filed:

Oct 10, 2008

Appl. No.:

12/249215

Inventors:

Hong Shih - Santa Clara CA, US
Saurabh Ullal - South San Francisco CA, US
Tuochuan Huang - Saratoga CA, US
Yan Fang - Fremont CA, US
Jon McChesney - Santa Clara CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G01R 27/26

US Classification:

324658, 324674

Abstract:

The present invention provides a reliable, non-invasive, electrical test method for predicting satisfactory performance of electrostatic chucks (ESCs). In accordance with an aspect of the present invention, a parameter, e. g. , impedance, of an ESC is measured over a frequency band to generate a parameter functions. This parameter function may be used to establish predetermined acceptable limits of the parameter within the frequency band.

US Patent:

8171877, May 8, 2012

Filed:

Jun 30, 2008

Appl. No.:

12/164285

Inventors:

Jason Augustino - Fremont CA, US
Armen Avoyan - Glendale CA, US
Yan Fang - Fremont CA, US
Duane Outka - Fremont CA, US
Hong Shih - Walnut CA, US
Stephen Whitten - Danville CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B05C 13/00
B05C 13/02
B05C 21/00
C23C 16/00
C23C 16/50
C23F 1/00
H01L 21/306

US Classification:

118503, 118723 E, 118723 R, 118715, 118500, 1563451, 15634534

Abstract:

A carrier assembly is provided comprising a backside mounted electrode carrier and electrode mounting hardware. The backside mounted electrode carrier comprises an electrode accommodating aperture, which in turn comprises a sidewall structure that is configured to limit lateral movement of an electrode positioned in the aperture. The electrode accommodating aperture further comprises one or more sidewall projections that support the weight of an electrode positioned in the aperture. The electrode mounting hardware is configured to engage an electrode positioned in the electrode accommodating aperture from the backside of the carrier and urge the electrode against the sidewall projections so as to limit axial movement of the electrode in the electrode accommodating aperture. Additional embodiments of broader and narrower scope are contemplated.

US Patent:

8221552, Jul 17, 2012

Filed:

Mar 30, 2007

Appl. No.:

11/730296

Inventors:

Duane Outka - Fremont CA, US
Jason Augustino - Fremont CA, US
Armen Avoyan - Glendale CA, US
Stephen Whitten - Danville CA, US
Hong Shih - Walnut CA, US
Yan Fang - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B08B 17/02
B08B 3/04
B08B 5/02
B08B 1/04

US Classification:

134 3, 134 6, 134 21, 134 26, 134 28, 134 30

Abstract:

Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.

US Patent:

8276604, Oct 2, 2012

Filed:

Jun 30, 2008

Appl. No.:

12/164288

Inventors:

Jason Augustino - Fremont CA, US
Armen Avoyan - Glendale CA, US
Yan Fang - Fremont CA, US
Duane Outka - Fremont CA, US
Hong Shih - Walnut CA, US
Stephen Whitten - Danville CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H05H 1/34
H01J 37/02
H01J 37/32
H01L 21/00
C23C 16/00

US Classification:

134137, 134 59, 134 85, 134166 R, 1563451, 15634514, 15634523, 15634551, 15634547, 118723 E

Abstract:

In accordance with one embodiment of the present disclosure, an assembly is provided comprising a multi-component electrode and a peripherally engaging electrode carrier. The peripherally engaging electrode carrier comprises a carrier frame and a plurality of reciprocating electrode supports. The multi-component electrode is positioned in the electrode accommodating aperture of the carrier frame. The backing plate of the electrode comprises a plurality of mounting recesses formed about its periphery. The reciprocating electrode supports can be reciprocated into and out of the mounting recesses. Additional embodiments of broader and narrower scope are contemplated.

US Patent:

8545639, Oct 1, 2013

Filed:

Oct 31, 2011

Appl. No.:

13/285203

Inventors:

Hong Shih - Santa Clara CA, US
John Daugherty - Fremont CA, US
Dean J. Larson - Fremont CA, US
Tuochuan Huang - Saratoga CA, US
Armen Avoyan - Glendale CA, US
Jeremy Chang - Sunnyvale CA, US
Sivakami Ramanathan - Fremont CA, US
Robert Anderson - Newark CA, US
Yan Fang - Fremont CA, US
Duane Outka - Fremont CA, US
Paul Mulgrew - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

C23G 1/00
C23G 1/02
B08B 3/00

US Classification:

134 28, 134 2, 134 3, 134 26, 134 29

Abstract:

A method of cleaning a surface of a component of a plasma chamber, wherein the component has an aluminum or anodized aluminum surface, the method including the steps of: soaking the surface of the component in a diluted sulfuric peroxide (DSP) solution; spray rinsing the surface with water following removal of the surface from the DSP solution; soaking the surface in a dilute nitric acid (HNO) solution; spray rinsing the surface with water following removal of the surface from the dilute nitric acid solution; and repeating at least twice the steps of soaking the surface in dilute nitric acid followed by spray rinsing the surface.

US Patent:

20120153971, Jun 21, 2012

Filed:

Feb 13, 2012

Appl. No.:

13/372423

Inventors:

Hong Shih - Santa Clara CA, US
Saurabh Ullal - , US
Tuochuan Huang - Saratoga CA, US
Yan Fang - Fremont CA, US
Jon McChesney - Santa Clara CA, US

International Classification:

G01R 27/26
G01R 23/02

US Classification:

324658, 324 7639

Abstract:

The present invention provides a reliable, non-invasive, electrical test method for predicting satisfactory performance of electrostatic chucks (ESCs). In accordance with an aspect of the present invention, a parameter, e.g., impedance, of an ESC is measured over a frequency band to generate a parameter functions. This parameter function may be used to establish predetermined acceptable limits of the parameter within the frequency band.

US Patent:

20130102156, Apr 25, 2013

Filed:

Sep 24, 2012

Appl. No.:

13/625489

Inventors:

Lam Research Corporation - Fremont CA, US
Hong Shih - Walnut CA, US
Robert G. O'Neill - Fremont CA, US
Tae Won Kim - Dublin CA, US
Raphael Casaes - Santa Clara CA, US
Yan Fang - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B05B 1/00
B32B 3/02
H01L 21/3065
B32B 3/30
B05D 3/12
C23C 16/44

US Classification:

438710, 427331, 4272481, 427289, 428155, 428 666, 239589, 257E21218

Abstract:

A component of a plasma processing chamber includes a three dimensional body having a highly dense plasma resistant coating thereon wherein a plasma exposed surface of the coating has a texture which inhibits particle generation from film buildup on the plasma exposed surface. The component can be a window of an inductively coupled plasma reactor wherein the window includes a textured yttria coating. The texture can be provided by contacting the plasma exposed surface with a polishing pad having a grit size effective to provide intersecting scratches with a depth of 1 to 2 microns.