Yang Hsiu Yeh Lin

US Patent:

20110067984, Mar 24, 2011

Filed:

Sep 9, 2010

Appl. No.:

12/878237

Inventors:

Clark Tu-Cuong Nguyen - Oakland CA, US
Yang Lin - Albany CA, US
Wei-Chang Li - Berkeley CA, US
Bongsang Kim - Albuquerque NM, US

Assignee:

THE REGENTS OF THE UNIVERSITY OF CALIFORNIA - Oakland CA

International Classification:

H01H 57/00

US Classification:

200181

Abstract:

A modally driven oscillating element periodically contacts one of more electrical contacts, thereby acting as a switch, otherwise known as a resonant switch, or “resoswitch”, with very high Q's, typically above 10000 in air, and higher in vacuum. Due to periodic constrained contacting of the contacts, the bandwidth of the switch is greatly improved. One or more oscillating elements may be vibrationally interconnected with conductive or nonconductive coupling elements, whereby increased bandwidths of such an overall switching system may be achieved. Using the resoswitch, power amplifiers and converters more closely approaching ideal may be implemented. Integrated circuit fabrication techniques may construct the resoswitch with other integrated CMOS elements for highly compact switching devices. Through introduction of specific geometries within the oscillating elements, displacement gains may be made where modal deflections are greatly increased, thereby reducing device drive voltages to 2.5 V or lower.

US Patent:

20190169018, Jun 6, 2019

Filed:

May 21, 2018

Appl. No.:

15/985283

Inventors:

- San Jose CA, US
Yang LIN - Fremont CA, US
Joseph SEEGER - Menlo Park CA, US

Assignee:

InvenSense, Inc. - San Jose CA

International Classification:

B81B 7/00

Abstract:

A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.

US Patent:

20160155595, Jun 2, 2016

Filed:

Dec 4, 2015

Appl. No.:

14/959034

Inventors:

- Oakland CA, US
Yang Lin - Albany CA, US

Assignee:

THE REGENTS OF THE UNIVERSITY OF CALIFORNIA - Oakland CA

International Classification:

H01H 59/00
H03H 9/24
H02M 3/07

Abstract:

A circuit of N micromechanical resonant switches (resoswitches) is presented, which mimics a Dickson charge pump to amplify an input voltage to an output voltage of N plus 1 times the input voltage, while avoiding the diode voltage drop and breakdown voltage limitations of CMOS-based conventional charge pumps. Important aspects of successful charge pumping are: 1) the long cycle lifetime of resonant micromechanical switches, which has been shown to operate 173.9×10cycles, is orders of magnitude higher than non-resonant switches; 2) the use of gated-sinusoid drive excitation to allow a charging period independent of resoswitch resonance frequency; and 3) the use of resonance operation to lower required drive and DC-bias voltages to below the supply voltage. This mechanical charge pump obviates the need for custom high voltage CMOS for applications where large voltages are needed such as MEMS-based timing references, thereby allowing the use of virtually any CMOS process.