Robert Kaim - Brookline MA, US Joseph D. Sweeney - Winsted CT, US Oleg Byl - Southbury CT, US Sharad N. Yedave - Danbury CT, US Edward E. Jones - Woodbury CT, US Peng Zou - Ridgefield CT, US Ying Tang - Brookfield CT, US Barry Lewis Chambers - Midlothian VA, US Richard S. Ray - New Milford CT, US
Assignee:
Advanced Technology Materials, Inc. - Danbury CT
International Classification:
H01L 21/26 H01L 21/42
US Classification:
438513, 438525, 438535
Abstract:
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of BF. Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.
Isotopically-Enriched Boron-Containing Compounds, And Methods Of Making And Using Same
Robert Kaim - Brookline MA, US Joseph D. Sweeney - Winsted CT, US Oleg Byl - Southbury CT, US Sharad N. Yedave - Danbury CT, US Edward E. Jones - Woodbury CT, US Peng Zou - Ridgefield CT, US Ying Tang - Brookfield CT, US Barry Lewis Chambers - Midlothian VA, US Richard S. Ray - New Milford CT, US
Assignee:
Advanced Technology Materials, Inc. - Danbury CT
International Classification:
H01L 21/26 H01L 21/42
US Classification:
438513, 438525, 438535, 257E21311
Abstract:
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of BF. Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.
Isotopically-Enriched Boron-Containing Compounds, And Methods Of Making And Using Same
Robert Kaim - Brookline MA, US Joseph D. Sweeney - Winsted CT, US Oleg Byl - Southbury CT, US Sharad N. Yedave - Danbury CT, US Edward E. Jones - Woodbury CT, US Peng Zou - Ridgefield CT, US Ying Tang - Brookfield CT, US Barry Lewis Chambers - Midlothian VA, US Richard S. Ray - New Milford CT, US
Assignee:
Advanced Technology Materials, Inc. - Danbury CT
International Classification:
H01L 21/425
US Classification:
438515, 257E21334, 257E21473, 427523
Abstract:
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms contains a desired isotope of boron in a concentration or ratio greater than a natural abundance concentration or ratio thereof. The compound may have a chemical formula of BF. Synthesis methods for such compounds, and ion implantation methods using such compounds, are described, as well as storage and dispensing vessels in which the isotopically-enriched, boron-containing compound is advantageously contained for subsequent dispensing use.
Ying Tang - Cambridge MA, US Igor Sokolik - Cambridge MA, US Adam Winkleman - Cambridge MA, US Seth Johnson - Cambridge MA, US Brian Mayers - Cambridge MA, US Patrick Reust - Cambridge MA, US Wendell Ray Guffey - Swansea IL, US Yimin Zhang - Ballwin MO, US Regina Pratt - St. Louis MO, US
International Classification:
A01K 1/01 A01K 29/00
US Classification:
119173, 119171
Abstract:
The invention provides animal litters and methods of making and using such litters. The animal litters comprise (a) a plurality of absorbent particles comprising (i) a non-swelling particle and (ii) a clumping material coated on the non-swelling particle and (b) a plurality of one or more filler particles that are not associated with the absorbent particles. The filler particles provide additional functionality to the litters, e.g., controlling odor, absorbing moisture, releasing fragrance, controlling microorganisms, controlling dust, reducing density, reducing weight, and combinations thereof. The litters are made by producing the absorbent particles using conventional means and combining the absorbent particles with one or more filler particles that impart the desired characteristic to the litters.
Ion Source Cleaning In Semiconductor Processing Systems
Joseph D. Sweeney - Winsted CT, US Sharad N. Yedave - Danbury CT, US Oleg Byl - Southbury CT, US Robert Kaim - Brookline MA, US David Eldridge - Liberty Hill TX, US Steven Sergi - Woodbury CT, US Lin Feng - Danbury CT, US Steven E. Bishop - Corrales NM, US W. Karl Olander - Indian Shores FL, US Ying Tang - Danbury CT, US
Cleaning of an ion implantation system or components thereof, utilizing a reactive cleaning reagent enabling growth/etching of the filament in an ion source of the arc chamber, by appropriate control of temperature in the arc chamber to effect the desired filament growth or alternative filament etching. Also described is the use of reactive gases such as XeFx, WFx, AsFx, PFx and TaFx, wherein x has a stoichioimetrically appropriate value or range of values, for cleaning regions of ion implanters, or components of implanters, in in situ or ex situ cleaning arrangements, under ambient temperature, elevated temperature or plasma conditions. Among specific reactive cleaning agents, BrF3 is described as useful for cleaning ion implant systems or component(s) thereof, in in situ or ex situ cleaning arrangements. Also described is a method of cleaning the forelines of an ion implant system for at least partial removal of ionization-related deposit from said forelines, comprising contacting said forelines with a cleaning gas wherein said cleaning gas is chemically reactive with said deposit. Also described is a method of improving the performance and extending the lifetime of an ion implant system, comprising contacting the cathode with a gas mixture.
Ion Source Cleaning In Semiconductor Processing Systems
Joseph D. Sweeney - Winsted CT, US Sharad N. Yedave - Danbury CT, US Oleg Byl - Southbury CT, US Robert Kaim - Brookline MA, US David Eldridge - Liberty Hill TX, US Lin Feng - Orange CT, US Steven E. Bishop - Corrales NM, US W. Karl Olander - Indian Shores FL, US Ying Tang - Danbury CT, US
Assignee:
ADVANCED TECHNOLOGY MATERIALS, INC. - Danbury CT
International Classification:
B08B 5/00 B05D 3/10 B05D 5/12
US Classification:
427 58, 134 31
Abstract:
Cleaning of an ion implantation system or components thereof, utilizing temperature and/or a reactive cleaning reagent enabling growth/etching of the cathode in an indirectly heated cathode for an ion implantation system by monitoring the cathode bias power and taking corrective action depending upon compared values to etch or regrow the cathode.
Feb 2014 to 2000 InternMarketing Department Guangzhou, CN Jan 2013 to Mar 2013 InternClient Service Department Guangzhou, CN Sep 2012 to Nov 2012 InternHR Department Guangzhou, CN Jul 2009 to Sep 2009 Intern
Education:
Ji Nan University Jul 2013 Bachelor of Management in MarketingJohns Hopkins University Carey Business School Master of Science in Marketing
License Records
Ying Tang
Address:
Lexington, MA 02421
License #:
2299 - Active
Issued Date:
Apr 7, 2008
Expiration Date:
Oct 28, 2017
Type:
Massage Therapist Practitioner
Name / Title
Company / Classification
Phones & Addresses
Ying Mei Tang President
TANG ENTERPRISES, INC
4 Somerset Ave, Winthrop, MA 02152 102 Safford St, Quincy, MA 02170