Ying Wang

US Patent:

6449158, Sep 10, 2002

Filed:

Dec 20, 2001

Appl. No.:

10/027040

Inventors:

Ying Wang - Wheeling IL
Clark D. Fischbach - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361704, 361705, 361707, 361719, 361761, 257706, 257720, 2282622, 165 803, 165185

Abstract:

An electronic control module is provided wherein a power device is secured to a rigidizer, or heat spreader, such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface , preferably anodized aluminum, is disposed between device and rigidizer and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings are respectively applied to the surfaces and of the interface and surface of the rigidizer.

US Patent:

6490279, Dec 3, 2002

Filed:

Jul 23, 1998

Appl. No.:

09/121586

Inventors:

Honglu Chen - Saratoga CA
Ying Wang - Sunnyvale CA

Assignee:

Advanced Communication Device, Inc. - Fremont CA

International Classification:

H04L 1256

US Classification:

370392, 370475, 711216

Abstract:

This invention discloses an improved address table apparatus that includes an address bus for receiving input data packets and for hashing a designated bucket number and extracting a key from each of the data packets. The address table apparatus further includes a plurality of memory banks connected to the address bus wherein each memory bank includes a plurality of memory buckets for storing a designation address (DA) and a port number in each of the buckets. The address table apparatus further includes a comparand bus connected to the address bus for receiving the key therefrom. The address table apparatus further includes a plurality of comparators each corresponding to one of the memory banks for receiving the designation address (DA) and the port number from the designated bucket from a corresponding memory bank. The comparators further connected to the comparand bus for receiving and comparing the key to the address from the designated bucket in each of the memory banks. The address table apparatus further includes a result bus connected to the comparators for displaying an output port number from one of the comparators if the key extracted from one the data packets matching the designation address (DA) from one of the designated buckets.

US Patent:

6654521, Nov 25, 2003

Filed:

Jan 23, 2002

Appl. No.:

10/056575

Inventors:

Yunlong Sheng - Fremont CA
Joshua E. Rothenberg - Fremont CA
HongPu Li - Fremont CA
Ying Wang - Fremont CA
Jason Zweiback - Fremont CA

Assignee:

Teraxion Inc. - Sainte-Foy

International Classification:

G02B 634

US Classification:

385 37

Abstract:

The present invention is directed to a system and method for designing efficient multi-channel FBG gratings using a pre-compensated phase mask for diffracting light for side-writing the grating on an optical fiber core. A desired phase function of the FBG is generated, specifically tailored to an effective spacing between the phase mask and the optical fiber core. From the phase function a phase mask is pre-compensated to offset diffraction effects associated with each longitudinal position of the FBG receiving light from two corresponding longitudinal positions of the phase mask substantially symmetrically spaced longitudinally relative to each particular longitudinal position of the FBG. The two corresponding longitudinal positions of the phase mask are spaced longitudinally from each other by a spacing determined by the effective spacing between the phase mask and fiber core and by the first order diffraction angle of light through the phase mask.

US Patent:

6696045, Feb 24, 2004

Filed:

Nov 22, 2002

Appl. No.:

10/302031

Inventors:

Jiang Yue - Beijing, CN
Long Zhu - Kobe Hyogo, JP
Li Chen - Beijing, CN
Ying Cheng - Beijing, CN
Tao Xu - Beijing, CN
Andrew Damian Weller - Mason OH
Ying Wang - Rochester NY

Assignee:

The Procter Gamble Company - Cincinnati OH

International Classification:

A61K 716

US Classification:

424 52, 424 49, 424 57

Abstract:

Disclosed are dentifrice compositions comprising in a single phase: (a) from about 0. 1% to about 30% of one or more linear polyphosphates having an average chain length of about 4 or more; (b) an ionic active ingredient selected from the group consisting of a fluoride ion source, a stannous ion source, a zinc ion source, a copper ion source and mixtures thereof, wherein the ionic active ingredient is present as a solid dispersion in the composition and delivers and effective amount of ionic active when solubilized; (c) a binder system comprised of (i) from about 0. 05% to about 3% of a thickening agent selected from the group consisting of polysaccharides, carbomers, poloxamers, modified celluloses, and mixtures thereof; and (ii) from about 0. 1% to about 70% of at least one humectant; wherein the dentifrice composition has a total water content of less than about 10%. Further disclosed are methods for stabilizing dentifrice compositions by providing such a binder system.

US Patent:

6721312, Apr 13, 2004

Filed:

Jun 1, 2001

Appl. No.:

09/872080

Inventors:

Ying Wang - Mountain View CA

Assignee:

Pluris, Inc. - Cupertino CA

International Classification:

H04L 1256

US Classification:

370380, 370392, 370401

Abstract:

In a data packet router, a router fabric card for routing data packets is provided. The router fabric card comprises a plurality of ingress/egress ports, the ports connected through a switching facility for switching connection states of the port paths between individual ingress paths and individual egress paths on the fabric card, and a scheduling component for scheduling communication between ports on the fabric card. Data coming into ingress on the card is organized into individual data-packet trains, each individual train comprising data packets and inserted data denoting a starting point and an ending point of a train. The switching facility recognizes the start data and the end data of a train and switches port paths to a next-assigned connection state accordingly.

US Patent:

6749105, Jun 15, 2004

Filed:

Mar 21, 2002

Appl. No.:

10/103590

Inventors:

Ying Wang - Wheeling IL
Thomas P. Gall - Northbrook IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 120

US Classification:

22826251, 228208, 228245

Abstract:

A method for securing a metallic substrate ( ) to a metallic housing ( ). The method may include: firing a first solderable coating ( ) to an edge ( ) of the metallic substrate ( ); firing a second solderable coating ( ) to a groove ( ) of the metallic housing ( ); joining the edge ( ) of the metallic substrate ( ) to the groove ( ) of the metallic housing ( ) to form a joint ( ) at the first solderable coating and the second solderable coating; applying a solder ( ) to the joint ( ); and solder bonding the metallic substrate ( ) to the metallic housing ( ) to provide a hermetic seal at the joint ( ). There is also an electronic control module that incorporates the method.

US Patent:

6763580, Jul 20, 2004

Filed:

Mar 21, 2002

Appl. No.:

10/103084

Inventors:

Stanton Rak - Evanston IL
Ying Wang - Wheeling IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

29843, 29840, 2281801, 228254, 361760, 257678, 257734, 257773

Abstract:

A method and module for securing a conductive interconnect ( ) through a metallic substrate ( ). The method includes the steps of: forming a hole ( ) in the metallic substrate ( ), the hole ( ) defined by an internal surface ( ) of the metallic substrate ( ); applying an electrically insulating layer ( ) to the metallic substrate ( ) including the internal surface ( ); applying a solderable coating ( ) to at least a portion of the electrically insulating layer ( ) around the hole ( ); applying a solder ( ) to at least a portion of the solderable coating ( ) at and above the hole ( ); inserting the conductive interconnect ( ) through the hole ( ); and solder bonding the conductive interconnect ( ) within the hole ( ).

US Patent:

6777676, Aug 17, 2004

Filed:

Nov 21, 2002

Appl. No.:

10/303267

Inventors:

Ying Wang - San Jose CA
Yeishin Tung - San Jose CA
Anne Testoni - Bolton MA

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 2300

US Classification:

250310, 250306, 250307, 378 44, 378 45, 378 48, 257 48, 257750, 257754, 438 14, 438625, 438672, 3562371, 3562411, 356376

Abstract:

Disclosed are apparatus and methods for characterizing a potential defect of a semiconductor structure. A charged particle beam is scanned over a structure which has a potential defect. X-rays are detected from the scanned structure. The X-rays are in response to the charged particle beam being scanned over the structure. The potential defect of the scanned structure is characterized based on the detected X-rays. For example, it may be determined whether a potentially defective via has a SiO plug defect by comparing an X-ray count ratio of oxygen over silicon of the defective via with an X-ray count ratio of a known defect-free reference via. If the defective via has a relatively high ratio (more oxygen than silicon) as compared to the reference via, then it may be determined that a SiO plug defect is present within the defective via. Otherwise, the via may be defmed as having a different type of defect (e. g. , not a SiO plug defect) or defined resulting in a âfalseâ defect.