Ying Wang

US Patent:

6449158, Sep 10, 2002

Filed:

Dec 20, 2001

Appl. No.:

10/027040

Inventors:

Ying Wang - Wheeling IL
Clark D. Fischbach - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361704, 361705, 361707, 361719, 361761, 257706, 257720, 2282622, 165 803, 165185

Abstract:

An electronic control module is provided wherein a power device is secured to a rigidizer, or heat spreader, such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface , preferably anodized aluminum, is disposed between device and rigidizer and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings are respectively applied to the surfaces and of the interface and surface of the rigidizer.

US Patent:

6749105, Jun 15, 2004

Filed:

Mar 21, 2002

Appl. No.:

10/103590

Inventors:

Ying Wang - Wheeling IL
Thomas P. Gall - Northbrook IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 120

US Classification:

22826251, 228208, 228245

Abstract:

A method for securing a metallic substrate ( ) to a metallic housing ( ). The method may include: firing a first solderable coating ( ) to an edge ( ) of the metallic substrate ( ); firing a second solderable coating ( ) to a groove ( ) of the metallic housing ( ); joining the edge ( ) of the metallic substrate ( ) to the groove ( ) of the metallic housing ( ) to form a joint ( ) at the first solderable coating and the second solderable coating; applying a solder ( ) to the joint ( ); and solder bonding the metallic substrate ( ) to the metallic housing ( ) to provide a hermetic seal at the joint ( ). There is also an electronic control module that incorporates the method.

US Patent:

6763580, Jul 20, 2004

Filed:

Mar 21, 2002

Appl. No.:

10/103084

Inventors:

Stanton Rak - Evanston IL
Ying Wang - Wheeling IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

29843, 29840, 2281801, 228254, 361760, 257678, 257734, 257773

Abstract:

A method and module for securing a conductive interconnect ( ) through a metallic substrate ( ). The method includes the steps of: forming a hole ( ) in the metallic substrate ( ), the hole ( ) defined by an internal surface ( ) of the metallic substrate ( ); applying an electrically insulating layer ( ) to the metallic substrate ( ) including the internal surface ( ); applying a solderable coating ( ) to at least a portion of the electrically insulating layer ( ) around the hole ( ); applying a solder ( ) to at least a portion of the solderable coating ( ) at and above the hole ( ); inserting the conductive interconnect ( ) through the hole ( ); and solder bonding the conductive interconnect ( ) within the hole ( ).

US Patent:

7309699, Dec 18, 2007

Filed:

Dec 17, 2004

Appl. No.:

11/015158

Inventors:

Jianguo Ji - Libertyville IL, US
Tao Li - Grayslake IL, US
Ying Wang - Lake Villa IL, US

Assignee:

Abbott Laboratories - Abbott Park IL

International Classification:

C07D 453/02
C07D 487/04

US Classification:

514183, 51425204, 51425505, 514256, 514305, 540557, 544238, 544333, 544405, 546133

Abstract:

Compounds of formula (I).

US Patent:

7683084, Mar 23, 2010

Filed:

Jun 27, 2007

Appl. No.:

11/769241

Inventors:

Ramin Faghih - Lake Forest IL, US
Gregory A. Gfesser - Lindenhurst IL, US
Christopher L. Lynch - Trevor WI, US
Murali Gopalakrishnan - Libertyville IL, US
Sujatha Gopalakrishnan - Libertyville IL, US
John Malysz - Round Lake IL, US
Earl J. Gubbins - Libertyville IL, US
Rachid El Kouhen - Libertyville IL, US
Jinhe Li - Long Grove IL, US
Kathy A. Sarris - Deerfield IL, US
Melissa J. Michmerhuizen - Beach Park IL, US
Ying Wang - Lake Villa IL, US

Assignee:

Abbott Laboratories - Abbott Park IL

International Classification:

A61K 31/427
A61K 31/343
A61K 31/4025
C07D 317/06
C07D 277/18
C07D 407/14

US Classification:

514370, 514422, 514423, 514465, 548184, 548517, 548518, 549435

Abstract:

The invention relates to a series of thiazoline and oxazoline derivatives, compositions thereof, and methods of treating conditions and disorders using such compounds.

US Patent:

8470813, Jun 25, 2013

Filed:

Jan 28, 2010

Appl. No.:

12/695567

Inventors:

Ramin Faghih - Lake Forest IL, US
Gregory A. Gfesser - Lindenhurst IL, US
Christopher L. Lynch - Trevor WI, US
Murali Gopalakrishnan - Libertyville IL, US
Sujatha Gopalakrishnan - Libertyville IL, US
John Malysz - Round Lake IL, US
Earl J. Gubbins - Libertyville IL, US
Rachid El Kouhen - Libertyville IL, US
Jinhe Li - Long Grove IL, US
Kathy A. Sarris - Deerfield IL, US
Melissa J. Michmerhuizen - Beach Park IL, US
Ying Wang - Lake Villa IL, US

Assignee:

AbbVie Inc. - North Chicago IL

International Classification:

A61K 31/551
A61K 31/426
A61K 31/427
A61K 31/445
A61K 31/421
A61K 31/47
A61P 29/00
A61P 15/08
A61P 19/02
A61P 1/04
A61P 25/00

US Classification:

514220, 514370, 514371, 514365, 514326, 514377, 514374, 514307, 514311

Abstract:

The invention relates to a series of thiazoline and oxazoline derivatives, compositions thereof, and methods of treating conditions and disorders using such compounds.

US Patent:

8518933, Aug 27, 2013

Filed:

Apr 22, 2010

Appl. No.:

12/765034

Inventors:

Ying Wang - Lake Villa IL, US
Jason T. Brewer - Zion IL, US
Stevan W. Djuric - Libertyville IL, US
Bhadra Shelat - Lake Forest IL, US
Frauke Pohlki - Mutterstadt, DE
Wilfried Braje - Mannhaim, DE
Ana-Lucia Relo - Gonnheim, DE

Assignee:

AbbVie Inc. - North Chicago IL
AbbVie Deutschland GmbH & Co. KG - Wiesbaden

International Classification:

C07D 515/00
A61K 31/553
A61P 25/00

US Classification:

5142111, 540548

Abstract:

The present application relates to 1,2,3,4,4a,5,6,7-octahydropyrazino[1,2 -a][1,4]benzodiazepine, 1,2,3,4,4a,5,6,7-octahydropyrazino[1,2-a][1,5]benzodiazepine, 2,3,4,4a,5,6,7,11b-octahydro-1H-pyrido[3,4-d][2]benzazepine, 1,2,3,4,4a,5,6,7 -octahydropyrazino[1,2-a][1]benzazepine, 1,2,3,4,4a,5-hexahydro-7H-pyrazino[1,2 -a][4,1]benzoxazepine, and 2,3,4,4a,5,6-hexahydro-1H-pyrazino[2,1-d][1,5]benzoxazepine, and 5,6,7,7a,8,9,10,11-octahydropyrazino[1,2-d]pyrido[3,2-b][1,4]diazepine derivatives of formula (I).

US Patent:

8546377, Oct 1, 2013

Filed:

Oct 21, 2010

Appl. No.:

12/909319

Inventors:

Ying Wang - Lake Villa IL, US
Jason T. Brewer - Zion IL, US
Stevan W. Djuric - Libertyville IL, US
Frauke Pohlki - Mutterstadt, DE
Wilfried Braje - Mannheim, DE
Ana-Lucia Relo - Gonnheim, DE

Assignee:

AbbVie Inc. - North Chicago IL
AbbVie Deutschland GmbH & Co. KG - Wiesbaden

International Classification:

C07D 515/00
A61K 31/553
A61P 25/00

US Classification:

5142111, 514220, 540497, 540548, 540559

Abstract:

The present application relates to 1,2,3,4,4a,5,6,7-octahydropyrazino[1,2-a][1,4]benzodiazepine, 1,2,3,4,4a,5,6,7-octahydropyrazino[1,2-a][1,5]benzodiazepine, 2,3,4,4a,5,6,7,11b-octahydro-1H-pyrido[3,4-d][2]benzazepine, 1,2,3,4,4a,5,6,7-octahydropyrazino[1,2-a][1]benzazepine, 1,2,3,4,4a,5-hexahydro-7H-pyrazino[1,2-a][4,1]benzoxazepine, and 2,3,4,4a,5,6-hexahydro-1H-pyrazino[2,1-d][1,5]benzoxazepine, and 5,6,7,7a,8,9,10,11-octahydropyrazino[1,2-d]pyrido[3,2-b][1,4]diazepine derivatives of formula (I).