Yong Kyu Yoon

US Patent:

20110300347, Dec 8, 2011

Filed:

Jun 6, 2011

Appl. No.:

13/153712

Inventors:

Yong Kyu Yoon - Gainesville FL, US
Gloria J. Kim - Gainesville GA, US
Gwan-Ha Kim - Soekwoodong, KR

Assignee:

UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. - Gainesville FL

International Classification:

B32B 3/00
H05B 6/00
B82Y 40/00

US Classification:

4281951, 264464, 264433, 977882

Abstract:

Various methods and systems are provided for the fabrication of patterned nanofibers. In one embodiment, a method includes generating a layer of electrospun nanofibers from a polymer solution and patterning the layer of electrospun nanofibers using ultraviolet (UV) lithography. The patterned electrospun nanofibers may then be thermally treated to form patterned carbon nanofibers. In another embodiment, a device includes a layer of patterned carbon nanofibers formed by generating electrospun nanofibers from a polymer solution, patterning the electrospun nanofibers using UV lithography, and converting the patterned electrospun nanofibers into patterned carbon nanofibers using a thermal treatment. In another embodiment, a method includes depositing electrospun nanofibers for a first predefined period of time, dissipating charge on the deposited electrospun nanofibers for a second predefined period of time where no electrospun nanofibers are deposited, and sequentially repeating the depositing and dissipating steps to from a layer of electrospun nanofibers having a predefined thickness.

US Patent:

20220344806, Oct 27, 2022

Filed:

Apr 22, 2022

Appl. No.:

17/727367

Inventors:

- Gainesville FL, US
Yong Kyu Yoon - Gainesville FL, US

International Classification:

H01Q 1/52
H01Q 21/06

Abstract:

Various examples are provided related to mutual coupling reduction between elements in antenna arrays. In one example, an antenna array includes patch antenna elements disposed on a first side of a substrate; and meander line (ML) slots formed in a ground plane disposed on a second side of the substrate. The ML slots can be disposed opposite a corresponding patch antenna element with the ML slot extending at an angle between first and second sides defining a corner that is adjacent to another patch antenna element. In another example, an antenna array includes first and second patch antenna elements disposed on a first side of a substrate and separated by a gap; and at least one meander line (ML) slots formed in a ground plane disposed on a second side of the substrate and aligned with the gap between the first and second patch antenna elements.

US Patent:

20190051972, Feb 14, 2019

Filed:

Oct 18, 2018

Appl. No.:

16/164536

Inventors:

- Gainesville FL, US
YONG KYU YOON - GAINESVILLE FL, US

International Classification:

H01Q 1/22
H01Q 15/14
H01L 23/498
H01L 23/492
H01L 23/66
H01Q 13/10
H01Q 9/04

Abstract:

Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through-glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.

US Patent:

20180372563, Dec 27, 2018

Filed:

Jun 21, 2018

Appl. No.:

16/014912

Inventors:

- Gainsville FL, US
Mark Sheplak - Gainesville FL, US
Yong Kyu Yoon - Gainesville FL, US
Jack Judy - Gainesville FL, US

International Classification:

G01L 1/14
G01L 9/00
B81B 3/00
H01Q 13/10

Abstract:

Methods and apparatuses for measuring static and dynamic pressures in harsh environments are disclosed. A pressure sensor according to one embodiment of the present invention may include a diaphragm constructed from materials designed to operate in harsh environments. A waveguide may be operably connected to the diaphragm, and an electromagnetic wave producing and receiving (e.g., sensing) device may be attached to the waveguide, opposite the diaphragm. A handle may be connected between the diaphragm and the waveguide to provide both structural support and electrical functionality for the sensor. A gap may be included between the handle and the diaphragm, allowing the diaphragm to move freely. An antenna and a ground plane may be formed on the diaphragm or the handle. Electromagnetic waves may be reflected off the antenna and detected to directly measure static and dynamic pressures applied to the diaphragm.

US Patent:

20170275178, Sep 28, 2017

Filed:

Sep 2, 2015

Appl. No.:

15/504781

Inventors:

- Gainesville FL, US
YONG KYU YOON - GAINESVILLE FL, US

International Classification:

C01G 23/053
H01L 41/318

Abstract:

Various examples are provided for multiferroic thin films. In one example, a multiferroic thin film device includes a thin film of multiferroic material and an electrode disposed on a side of the thin film of multiferroic material. The multiferroic material can be (Fe,Sr)TiOIn another example, a method for producing a multiferroic thin film includes forming a multiferroic pre-cursor; disposing the multiferroic precursor on a substrate to form a multiferroic coating; pre-baking the multiferroic coating on the substrate to form a pre-baked multiferroic thin film; and annealing the pre-baked multiferroic thin film under an oxygen atmosphere to form a crystalized multiferroic thin film. One or more electrodes can be formed on the crystalized multiferroic thin film.