Yoon Jung Lee

US Patent:

20210356978, Nov 18, 2021

Filed:

Dec 29, 2020

Appl. No.:

17/136498

Inventors:

- Dallas TX, US
YOON JAE LEE - ALLEN TX, US
JEFFREY HOWARD ENOCH - MELISSA TX, US

International Classification:

G05F 1/46

Abstract:

In described examples, a source circuit can have an input and an output. The input can be adapted to be coupled to an input voltage source configured to provide an input voltage. The source circuit can be configured to output power at an output based on a power delivery mode. The source circuit can include a timer and power delivery (PD) controller. The PD controller can be configured to control the power delivery mode responsive to the input voltage and the timer. The PD controller can be further configured to set a respective power delivery mode and initiate the timer for a timer duration based on the input voltage relative to an input voltage threshold. The PD controller can be further configured to continue operating in the respective power delivery mode for the timer duration.

US Patent:

20180011810, Jan 11, 2018

Filed:

Sep 25, 2017

Appl. No.:

15/714897

Inventors:

- Dallas TX, US
Yoon Lee - Allen TX, US
Brian Quach - Richardson TX, US
Lee Myers - Wylie TX, US
Wesley Ray - Rockwall TX, US
Win Maung - Plano TX, US

International Classification:

G06F 13/38
G06F 1/16
G06F 13/42

Abstract:

A method includes generating, by a control unit of a first device, a handshaking signal to be transmitted to a second device via a second channel. The method further includes based on the handshaking signal being acknowledged by the second device, configuring, by the control unit, the second channel to communicate non-display data and configuring a first channel connecting the first device to the second device to selectively communicate either display data or non-display data; and based on the handshaking signal being not acknowledged by the second device, configuring, by the control unit, the first channel to communicate display data.

US Patent:

20140297898, Oct 2, 2014

Filed:

Mar 14, 2014

Appl. No.:

14/212810

Inventors:

- DALLAS TX, US
Yoon Lee - Allen TX, US
Brian Quach - Richardson TX, US
Lee Myers - Wylie TX, US
Wesley Ray - Rockwall TX, US
Win Maung - Plano TX, US

International Classification:

G06F 13/38
G06F 1/16
G06F 13/42

US Classification:

710 14, 710316, 710304

Abstract:

A method includes generating, by a control unit of a first device, a handshaking signal to be transmitted to a second device via a second channel. The method further includes based on the handshaking signal being acknowledged by the second device, configuring, by the control unit, the second channel to communicate non-display data and configuring a first channel connecting the first device to the second device to selectively communicate either display data or non-display data; and based on the handshaking signal being not acknowledged by the second device, configuring, by the control unit, the first channel to communicate display data.

US Patent:

20140264400, Sep 18, 2014

Filed:

Jun 6, 2014

Appl. No.:

14/298875

Inventors:

- Ithaca NY, US
Yoon Ho Lee - Ithaca NY, US

Assignee:

Cornell University - Ithaca NY

International Classification:

H01L 25/16
H01L 33/58
H01L 25/00
H01L 31/0232

US Classification:

257 88, 257432, 438 23, 438 59

Abstract:

Techniques, systems, and devices are disclosed to provide multilayer platforms for integrating semiconductor integrated circuit dies, optical waveguides and photonic devices to provide intra-die or inter-die optical connectivity. For example, an integrated semiconductor device having integrated circuits respectively formed on different semiconductor integrated circuit dies is provided to include a carrier substrate structured to form openings on a top side of the carrier substrate; semiconductor integrated circuit dies fixed to bottom surfaces of the openings of the carrier substrate, each semiconductor integrated circuit die including a semiconductor substrate and an integrated circuit formed on the semiconductor substrate to include one or more circuit components, and each semiconductor integrated circuit die being structured to have a top surface substantially coplanar with the top side of the carrier substrate; and planar layers formed on top of the top surfaces of the semiconductor integrated circuit dies and the top side of the carrier substrate to include optical waveguides and photonic devices to provide (1) intra-die optical connectivity for photonic devices associated with a semiconductor integrated circuit die, or (2) inter-die optical connectivity for photonic devices associated with different semiconductor integrated circuit dies.