Yu Chun Kuo

US Patent:

44755279, Oct 9, 1984

Filed:

Jun 11, 1982

Appl. No.:

6/387648

Inventors:

Yu Shen Kuo - La Crescenta CA

Assignee:

The United States of America as represented by the Administrator of the
National Aeronautics and Space Administration - Washington DC

International Classification:

B28D 104

US Classification:

125 13R

Abstract:

An improvement in a method for simultaneously slicing one or a multiplicity of boules of silicon into silicon wafers, the improvement of which comprises forming a plurality of vertical stacks of horizontal saw blades of circular configuration arranged in juxtaposed coaxial alignment, each blade being characterized by having a cutting diameter slightly greater than the cutting diameter of the blade arranged immediately thereabove; imparting simultaneous rotation to the blades, supporting in depending relation a plurality of enlongated boules of silicon, simultaneously translating the boules through the blades, and simultaneously imparting rotation to the boules as the boules are passed through said blades for slicing wafers therefrom; and an improved apparatus for performing said method.