Yu Fei Zhang

US Patent:

20220277020, Sep 1, 2022

Filed:

May 16, 2022

Appl. No.:

17/663628

Inventors:

- San Francisco CA, US
Jialiang Li - San Francisco CA, US
Kaiyue Sun - San Francisco CA, US
Li Chen Koh - San Francisco CA, US
Mingye Xia - San Francisco CA, US
Yu Zhang - San Jose CA, US
Yuyang Guo - Mountain View CA, US

International Classification:

G06F 16/27

Abstract:

One or more embodiments of a synchronization system facilitate selectivity synchronizing digital content items from a collection of digital content items to a local storage of a client device. In particular, one or more embodiments described herein collect and analyze recall data for users of a digital content management system with respect to digital content items to determine synchronization scores for the digital content items. One or more embodiments described herein further include selectively identifying a subset of the digital content items based on the synchronization scores to recommend for synchronization to a local storage of a client device.

US Patent:

20210296242, Sep 23, 2021

Filed:

Jun 7, 2021

Appl. No.:

17/340781

Inventors:

- Santa Clara CA, US
Kevin J. Doran - North Plains OR, US
Yu Amos Zhang - Raleigh NC, US
Zhiguo Qian - Chandler AZ, US

International Classification:

H01L 23/538
H01L 25/18
H01L 23/498
H01L 23/13
H01L 25/065

Abstract:

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

US Patent:

20210224301, Jul 22, 2021

Filed:

Apr 5, 2021

Appl. No.:

17/301510

Inventors:

- San Francisco CA, US
Yu Zhang - San Francisco CA, US
Brandon Iles - San Francisco CA, US

International Classification:

G06F 16/29
H04W 4/02
G06F 3/0488
G06F 3/0482
G06F 3/0481
G06F 16/248
G06F 16/22
G06F 16/9535
G06F 16/9537
G06F 16/2457

Abstract:

Systems and methods for improving a search process by providing a visual guided search experience is provided. A networked system determines a location of a user device. A user interface (UI) is presented illustrating a map at a first level view of an area based on the location. The networked system receives, via the UI, a first touch input indicating a zoom selection. In response, the UI shows a second level view of the area that includes a plurality of nodes each representing a point of interest in the area. The second level view is a lower level view than the first level view. The networked system then receives, via the UI, a second touch input selecting a node of the plurality of node. In response to the selecting of the node, navigation information for a selected point of interest corresponding to the selected node is presented.

US Patent:

20210012166, Jan 14, 2021

Filed:

Jul 11, 2019

Appl. No.:

16/509152

Inventors:

- Mountain View CA, US
Volodymyr Ivanchenko - Redwood City CA, US
Yu Zhang - Mountain View CA, US

International Classification:

G06K 9/62
G06T 7/32
G06T 7/73
G06K 9/00

Abstract:

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining an alignment between cross-modal sensor data. In one aspect, a method comprises: obtaining (i) an image that characterizes a visual appearance of an environment, and (ii) a point cloud comprising a collection of data points that characterizes a three-dimensional geometry of the environment; processing each of a plurality of regions of the image using a visual embedding neural network to generate a respective embedding of each of the image regions; processing each of a plurality of regions of the point cloud using a shape embedding neural network to generate a respective embedding of each of the point cloud regions; and identifying a plurality of region pairs using the embeddings of the image regions and the embeddings of the point cloud regions.

US Patent:

20210012555, Jan 14, 2021

Filed:

Jul 8, 2020

Appl. No.:

16/924080

Inventors:

- Mountain View CA, US
Pei Sun - Palo Alto CA, US
Yu Zhang - Santa Clara CA, US
Dragomir Anguelov - San Francisco CA, US
Jiyang Gao - San Jose CA, US
Yu Ouyang - San Jose CA, US
Zijian Guo - Sunnyvale CA, US
Jiquan Ngiam - Mountain View CA, US
Vijay Vasudevan - Los Altos Hills CA, US

International Classification:

G06T 15/20
G06K 9/00

Abstract:

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for processing point cloud data using dynamic voxelization. When deployed within an on-board system of a vehicle, processing the point cloud data using dynamic voxelization can be used to make autonomous driving decisions for the vehicle with enhanced accuracy, for example by combining representations of point cloud data characterizing a scene from multiple views of the scene.

US Patent:

20200300912, Sep 24, 2020

Filed:

Mar 22, 2019

Appl. No.:

16/361816

Inventors:

- Santa Clara CA, US
Nathan BLACKWELL - Hillsboro OR, US
Matthew BOELTER - Hillsboro OR, US
Geoffrey KELLY - Hillsboro OR, US
James NEEB - Gilbert AZ, US
Sundar PATHY - Chandler AZ, US
Yu ZHANG - Chandler AZ, US
Shelby ROLLINS - Hillsboro OR, US

International Classification:

G01R 31/317
G01R 31/319

Abstract:

Embodiments described herein may be directed to receiving a plurality of data captured, respectively, by a plurality of test instruments coupled to a device under test, wherein a plurality of data elements within, respectively, the plurality of captured data are associated with a timestamp based upon a time a data element was captured. Embodiments may also analyze the received plurality of data captured, respectively, by the one or more test instruments, and graphically display at least a portion of the analyzed plurality of captured data to a user. Other embodiments may be identified herein.

US Patent:

20200004842, Jan 2, 2020

Filed:

Jun 27, 2018

Appl. No.:

16/020267

Inventors:

- San Francisco CA, US
Yu Zhang - San Francisco CA, US
Brandon Iles - San Francisco CA, US

International Classification:

G06F 17/30
H04W 4/02
G06F 3/0488
G06F 3/0482
G06F 3/0481

Abstract:

Systems and methods for improving a search process by providing a visual guided search experience is provided. A networked system determines a location of a user device. A user interface (UI) is presented illustrating a map at a first level view of an area based on the location. The networked system receives, via the UI, a first touch input indicating a zoom selection. In response, the UI shows a second level view of the area that includes a plurality of nodes each representing a point of interest in the area. The second level view is a lower level view than the first level view. The networked system then receives, via the UI, a second touch input selecting a node of the plurality of node. In response to the selecting of the node, navigation information for a selected point of interest corresponding to the selected node is presented.

US Patent:

20190341349, Nov 7, 2019

Filed:

Mar 29, 2017

Appl. No.:

16/474005

Inventors:

Kevin J. DORAN - North Plains OR, US
MD Altaf HOSSAIN - Portland OR, US
Yu Amos ZHANG - Chandler AZ, US
Zhiguo QIAN - Chandler, AZ
- Santa Clara CA, US

International Classification:

H01L 23/538
H01L 21/48
H01L 25/065
H01L 25/18
H01L 25/00

Abstract:

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.