Yu U Zhang

US Patent:

20210296242, Sep 23, 2021

Filed:

Jun 7, 2021

Appl. No.:

17/340781

Inventors:

- Santa Clara CA, US
Kevin J. Doran - North Plains OR, US
Yu Amos Zhang - Raleigh NC, US
Zhiguo Qian - Chandler AZ, US

International Classification:

H01L 23/538
H01L 25/18
H01L 23/498
H01L 23/13
H01L 25/065

Abstract:

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

US Patent:

20200300912, Sep 24, 2020

Filed:

Mar 22, 2019

Appl. No.:

16/361816

Inventors:

- Santa Clara CA, US
Nathan BLACKWELL - Hillsboro OR, US
Matthew BOELTER - Hillsboro OR, US
Geoffrey KELLY - Hillsboro OR, US
James NEEB - Gilbert AZ, US
Sundar PATHY - Chandler AZ, US
Yu ZHANG - Chandler AZ, US
Shelby ROLLINS - Hillsboro OR, US

International Classification:

G01R 31/317
G01R 31/319

Abstract:

Embodiments described herein may be directed to receiving a plurality of data captured, respectively, by a plurality of test instruments coupled to a device under test, wherein a plurality of data elements within, respectively, the plurality of captured data are associated with a timestamp based upon a time a data element was captured. Embodiments may also analyze the received plurality of data captured, respectively, by the one or more test instruments, and graphically display at least a portion of the analyzed plurality of captured data to a user. Other embodiments may be identified herein.

US Patent:

20190341349, Nov 7, 2019

Filed:

Mar 29, 2017

Appl. No.:

16/474005

Inventors:

Kevin J. DORAN - North Plains OR, US
MD Altaf HOSSAIN - Portland OR, US
Yu Amos ZHANG - Chandler AZ, US
Zhiguo QIAN - Chandler, AZ
- Santa Clara CA, US

International Classification:

H01L 23/538
H01L 21/48
H01L 25/065
H01L 25/18
H01L 25/00

Abstract:

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.