Yuan Li

US Patent:

6477518, Nov 5, 2002

Filed:

Jan 31, 2000

Appl. No.:

09/495531

Inventors:

Yuan John Li - Novi MI
Mawutor Kofi Kpeglo - Canton MI
Yung-Sen Steven Shang - Canton MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G06F 1700

US Classification:

706 45, 706 46

Abstract:

A method of knowledge-based engineering cost and weight estimation of an HVAC air-handling assembly for a climate control system on a vehicle includes the steps of selecting a parametric model of an HVAC air-handling assembly design using a knowledge-based engineering library stored in a memory of a computer system. The method also includes the steps of selecting a component part from the parametric model of the HVAC air-handling assembly, determining a cost estimate of the component part using the knowledge-based engineering library and using a summation of the component part cost as the cost estimate of the HVAC air-handling assembly. The method further includes the steps of determining a weight estimate of the component part using the knowledge-based engineering library and using a summation of the component part weight as the weight estimate of the HVAC air-handling assembly. The method further includes the steps of using the cost and weight estimate in the HVAC air-handling assembly design.

US Patent:

6651037, Nov 18, 2003

Filed:

Dec 10, 1999

Appl. No.:

09/460342

Inventors:

Timothy J. Hall - Novi MI
Steven Kelley Howell - Dexter MI
Yuan (John) Li - Novi MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

G06G 748

US Classification:

703 8, 703 1, 345419

Abstract:

A method of optimized design of an HVAC air-handling assembly for a climate control system on a vehicle includes the steps of generating a basic design of the HVAC air-handling assembly and analyzing a performance of the basic design of the HVAC air-handling assembly using an engineering analytical technique. The method also includes the steps of varying the basic design of the HVAC air-handling assembly based on the performance analysis and using the optimized basic design of the HVAC air-handling assembly in generating the HVAC air-handling assembly design.

US Patent:

6888238, May 3, 2005

Filed:

Jul 9, 2003

Appl. No.:

10/616858

Inventors:

Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L023/34

US Classification:

257706

Abstract:

A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.

US Patent:

6909176, Jun 21, 2005

Filed:

Nov 20, 2003

Appl. No.:

10/719451

Inventors:

Wen-Chou Vincent Wang - Cupertino CA, US
Donald S. Fritz - San Jose CA, US
Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L023/10

US Classification:

257706, 257701, 257783, 257775

Abstract:

Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal interface material, which is used to attach the heat spreader to the low-K Si die, is selected as high as possible relative to other commercially available thermal interface materials. On the other hand, the modulus of the adhesive, which is used to attach the heat spreader via an optional stiffener to the substrate, is selected as low as possible relative to other commercially available adhesives. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the low-K Si die and package reliabilities are thereby enhanced.

US Patent:

6949404, Sep 27, 2005

Filed:

Nov 25, 2002

Appl. No.:

10/305671

Inventors:

Don Fritz - San Jose CA, US
Wen-chou Vincent Wang - Cupertino CA, US
Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L021/44
H01L021/48
H01L021/50

US Classification:

438106, 438107, 438108, 438125

Abstract:

Provided are a semiconductor flip chip package with warpage control and fabrication methods for such packages. The packages of the present invention include heat spreader lids that are rigidly attached to the die or packaging substrate with a bond that can withstand the considerable bowing pressures caused by the CTE mismatch between the die and substrate. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the PCB board to which it is ultimately bound. Package reliability is thereby also enhanced, particularly for large die sizes.

US Patent:

7009307, Mar 7, 2006

Filed:

May 19, 2004

Appl. No.:

10/849651

Inventors:

Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257783, 257707, 438118

Abstract:

Provided are a semiconductor die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the die and packaging substrate. In general, the modulus of the adhesive, which is used to attach the heat spreader to the substrate, is selected to provide a relatively “soft” connection. The result is a package with less bowing and so improved co-planarity (e. g. , in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the die and package reliabilities are thereby enhanced.

US Patent:

7144756, Dec 5, 2006

Filed:

May 10, 2005

Appl. No.:

11/126571

Inventors:

Wen-Chou Vincent Wang - Cupertino CA, US
Donald S. Fritz - San Jose CA, US
Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01I 21/44

US Classification:

438106, 257E23001

Abstract:

Provided are a semiconductor low-K Si die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the low-K Si die and packaging substrate. In general, the modulus of the thermal interface material, which is used to attach the heat spreader to the low-K Si die, is selected as high as possible relative to other commercially available thermal interface materials. On the other hand, the modulus of the adhesive, which is used to attach the heat spreader via an optional stiffener to the substrate, is selected as low as possible relative to other commercially available adhesives. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the low-K Si die and package reliabilities are thereby enhanced.

US Patent:

7300822, Nov 27, 2007

Filed:

Apr 28, 2005

Appl. No.:

11/118630

Inventors:

Yuan Li - Sunnyvale CA, US

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L 21/00

US Classification:

438122, 257706

Abstract:

A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.

Address:

487 Senna Ct, Sunnyvale, CA 94086

VIN:

5FNRL38867B065635

Make:

HONDA

Model:

ODYSSEY

Year:

2007