Yuanbo Lin

US Patent:

20120103700, May 3, 2012

Filed:

Nov 3, 2011

Appl. No.:

13/288154

Inventors:

Yuanbo Lin - Lewis Center OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

E21B 10/36

US Classification:

175428

Abstract:

A superabrasive compact cutting element, for example, a insert utilized in shear cutter bits. The cutting elements include a layer of superabrasive materials that is provided with different shapes and positions relative to the substrate in order to enhance the abrasion resistance performance of the cutting element. The cutting element includes a top, bottom and peripheral surface. The cutting element further includes at least one superabrasive material portion comprising polycrystalline diamond (PCD) or cubic boron nitride (CBN), a substrate supporting the at least one superabrasive material portion, and an interface where the at least one superabrasive material portion and the substrate are joined. The interface slopes downwardly with a slope angle of less than about 40 and/or the cutting element has a longitudinal thickness of the at least one superabrasive material portion measured along a peripheral surface of the cutting element in a longitudinal direction greater than about 3 mm.

US Patent:

20130022836, Jan 24, 2013

Filed:

Jul 19, 2012

Appl. No.:

13/552907

Inventors:

Thomas C. Easley - Bexley OH, US
Yuanbo Lin - Lewis Center OH, US
Dwight Dyer - Kingston OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

B32B 15/04
B23K 1/19
H05B 6/02
H05B 6/64
B23K 33/00
B23K 26/00
B23K 1/20
B23K 1/008

US Classification:

428622, 228208, 2282627, 2281221, 22826272, 219678, 219137 R, 21912185, 219600, 428634, 428627

Abstract:

The present disclosure relates to brazed coated diamond-containing materials and methods of producing brazed coated diamond-containing materials. The method for brazing the coated diamond-containing material may include bringing a braze metal into contact with the refractory metal layer and a substrate; heating at least the braze metal above the melting temperature of the braze metal; and bringing the braze metal into contact with the substrate to form a braze metal layer to join the diamond-containing material, braze metal layer, and substrate together. An advantage of the method may include that the brazing step may be performed in air, under ambient pressure, and without the need for a protective layer.

US Patent:

20130081882, Apr 4, 2013

Filed:

Sep 28, 2012

Appl. No.:

13/629958

Inventors:

Yuanbo Lin - Houston TX, US
Gary Flood - Canal Winchester OH, US
Steven Webb - Woodlands TX, US
Terrence Wilson - Columbus OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

G06F 17/50
E21B 10/46

US Classification:

175428, 703 1

Abstract:

A method for characterizing a three-dimensional spatial distribution of a characteristic of an ultra-hard body includes successively removing portions of the ultra-hard body to successively expose sub-portions, determining a characteristic of each of the exposed sub-portions, and reconstructing a three-dimensional spatial distribution of the characteristic of the ultra-hard body from the determined characteristic of each of the sub-portions.

US Patent:

20130167446, Jul 4, 2013

Filed:

Dec 29, 2011

Appl. No.:

13/339854

Inventors:

Yuanbo Lin - Lewis Center OH, US
Bruce Jake Reierson - Delaware OH, US
Joseph Michael Rhodes - Heath OH, US
John W. Lucek - Powell OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

B24D 3/04
B24D 18/00

US Classification:

51295, 51307, 51297

Abstract:

A cutter assembly includes a substrate and at least one island. The substrate includes a surface circumscribed by a peripheral edge, a flank surface extending from the peripheral edge, and at least one pocket with an opening on the surface and spaced apart from the peripheral edge. The at least one pocket extends from the opening towards an interior of the substrate. The at least one island is in the at least one pocket, and the at least one island includes a cutting surface that is exposed by the opening of the at least one pocket.

US Patent:

20130167449, Jul 4, 2013

Filed:

Dec 29, 2011

Appl. No.:

13/339474

Inventors:

Yuanbo Lin - Lewis Center OH, US
Bruce Jake Reierson - Delaware OH, US
Joseph Michael Rhodes - Heath OH, US
John W. Lucek - Powell OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

B24D 3/04

US Classification:

51309, 51307

Abstract:

A cutter assembly includes a substrate and at least one island. The substrate includes a surface circumscribed by a peripheral edge, a flank surface extending from the peripheral edge, and at least one pocket with an opening on the surface and spaced apart from the peripheral edge. The at least one pocket extends from the opening towards an interior of the substrate. The at least one island is in the at least one pocket, and the at least one island includes a cutting surface that is exposed by the opening of the at least one pocket.

US Patent:

20130167450, Jul 4, 2013

Filed:

Dec 29, 2011

Appl. No.:

13/339483

Inventors:

Yuanbo Lin - Lewis Center OH, US
Bruce Jake Reierson - Delaware OH, US
Joseph Michael Rhodes - Heath OH, US
John W. Lucek - Powell OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

B24D 3/04

US Classification:

51309, 51307

Abstract:

A cutter assembly includes a substrate and at least one island. The substrate includes a surface circumscribed by a peripheral edge, a flank surface extending from the peripheral edge, and at least one pocket with an opening on the surface and spaced apart from the peripheral edge. The at least one pocket extends from the opening towards an interior of the substrate. The at least one island is in the at least one pocket, and the at least one island includes a cutting surface that is exposed by the opening of the at least one pocket.

US Patent:

20130167451, Jul 4, 2013

Filed:

Dec 29, 2011

Appl. No.:

13/339838

Inventors:

Yuanbo Lin - Lewis Center OH, US
Bruce Jake Reierson - Delaware OH, US
Joseph Michael Rhodes - Heath OH, US
John W. Lucek - Powell OH, US

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

B24D 3/04

US Classification:

51309, 51307

Abstract:

A cutter assembly includes a substrate and at least one island. The substrate includes a surface circumscribed by a peripheral edge, a flank surface extending from the peripheral edge, and at least one pocket with an opening on the surface and spaced apart from the peripheral edge. The at least one pocket extends from the opening towards an interior of the substrate. The at least one island is in the at least one pocket, and the at least one island includes a cutting surface that is exposed by the opening of the at least one pocket.

US Patent:

20120055716, Mar 8, 2012

Filed:

Sep 6, 2011

Appl. No.:

13/226361

Inventors:

Malin Martensson - Nacka, SE
Yuanbo Lin - Lewis Center OH, US
Andreas Markstrom - Stockholm, SE
Susanne Norgren - Huddinge, SE

Assignee:

DIAMOND INNOVATIONS, INC. - Worthington OH

International Classification:

E21B 10/46
C09K 3/14

US Classification:

175428, 51309

Abstract:

A sintered cutting element including a superabrasive layer supported on a substrate. The superabrasive layer includes superabrasive material and secondary phase, and the substrate includes a binder phase. The sintered cutting element is formed by a high temperature high pressure sintering process in which separate source elements melt and sweep first through the superabrasive layer, and then to the substrate to form the secondary phase and binder phase. The superabrasive layer is substantially free of or free of eta-phase, CoWC. Further, the portion of the substrate nearest the interface between the superabrasive layer and the substrate has equal or more binder phase than portions of the substrate further from the interface. In certain embodiments, the superabrasive material includes polycrystalline diamond, and the substrate includes cobalt tungsten carbide.