Zhuqing Zhang

US Patent:

20080266242, Oct 30, 2008

Filed:

Apr 26, 2007

Appl. No.:

11/740649

Inventors:

Alan R. Arthur - Salem OR, US
Zhuqing Zhang - Corvallis OR, US

International Classification:

G09G 3/36

US Classification:

345103

Abstract:

A display element for a display device includes a display mechanism and a resin layer. One or more busbars and one or more multiplexing resistors are disposed within the resin layer. The multiplexing resistors are communicatively connected to one or more address lines to permit the display element to be addressed by selective assertion of the address lines in a multiplexing manner.

US Patent:

20100264560, Oct 21, 2010

Filed:

Dec 19, 2007

Appl. No.:

12/746738

Inventors:

Zhuqing Zhang - Corvallis OR, US

International Classification:

B29C 33/42
B28B 11/08

US Classification:

264220, 425385

Abstract:

An imprint lithography stamp () includes a base layer (); a functional layer () of lithography features () protruding from the base layer (); and a support layer () comprising a regular pattern of sub-features () protruding from the lithography features (). An imprint lithography system () includes a substrate () having a layer of resin material () deposited thereon; a stamp () having a base layer (), a functional layer () of lithography features () protruding from the base layer () and a support layer () comprising a regular pattern of sub-features () protruding from the lithography features (); and an imprinting device configured to press the stamp () into the resin material ().

US Patent:

20120012963, Jan 19, 2012

Filed:

Feb 27, 2009

Appl. No.:

13/145493

Inventors:

Zhuqing Zhang - Corvallis OR, US
Steve P. Hanson - Albany OR, US
Chien-Hua Chen - Corvallis OR, US

International Classification:

H01L 31/0216

US Classification:

257434, 438 68, 257E31119

Abstract:

In one embodiment, a method for making an optical micro device package includes: providing a substrate wafer having a plurality of solid state light sensors integrate therein; providing a transparent cover wafer coated with a material that alters the transparency characteristics of the cover wafer; forming a layer of light sensitive, photo definable adhesive material on the substrate wafer; selectively removing part of the layer of adhesive material in a pattern for a plurality of adhesive spacers between the substrate wafer and the cover wafer with each spacer surrounding a corresponding one of the light sensors; bonding the substrate wafer and the cover wafer together at the spacers to form a wafer assembly in which each spacer surrounds and seals a corresponding one of the light sensors within a cavity bounded by a spacer and the two wafers; and singulating individual device packages from the wafer assembly.

US Patent:

20120199920, Aug 9, 2012

Filed:

Feb 3, 2011

Appl. No.:

13/020591

Inventors:

Zhuqing ZHANG - Corvallis OR, US
Rodney L. Alley - Albany OR, US

International Classification:

B32B 3/10
H01L 21/58
B32B 3/02
H01L 29/84

US Classification:

257415, 438 51, 428131, 428 666, 257E29324, 257E21505

Abstract:

A structured glass wafer for packaging a microelectromechanical-system (MEMS) wafer. The structured glass wafer includes a sheet of glass, and an access hole. The sheet of glass has a first side and a second side, and is configured to provide a protective covering for MEMS devices. The access hole extends through the sheet of glass from the first side to the second side of the sheet of glass, and is configured to provide access to a group of electrical contacts of a group of MEMS devices. A packaged MEMS wafer including the structured glass wafer, and a method for fabricating a packaged MEMS wafer are also provided.

US Patent:

20230104463, Apr 6, 2023

Filed:

Apr 1, 2020

Appl. No.:

17/911557

Inventors:

- Spring TX, US
Zhuqing Zhang - Corvallis OR, US
Randy Hoffman - Corvallis OR, US
Gary G. Lutnesky - Corvallis OR, US

Assignee:

Hewlett-Packard Development Company, L.P. - Spring TX

International Classification:

B05C 5/02

Abstract:

An example molded fluidic die assembly includes a fluidic die including an electrical component and a fluidic architecture on a first face of the fluidic die, the fluidic architecture including a front face; circuitry; an electrical connection coupling the circuitry to the electrical component on the first face of the fluidic die; and a continuous molded compound that surrounds the fluidic die and encompasses the electrical connection.

US Patent:

20200139705, May 7, 2020

Filed:

Jan 8, 2020

Appl. No.:

16/737279

Inventors:

- Spring TX, US
Michael W. Cumbie - Corvallis OR, US
Zhuqing Zhang - Corvallis OR, US

International Classification:

B41J 2/14
B41J 2/16
H01L 23/00
H01L 21/67
H01L 21/56

Abstract:

Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

US Patent:

20170368835, Dec 28, 2017

Filed:

Jan 22, 2015

Appl. No.:

15/542024

Inventors:

- Houston TX, US
Silam J Choy - Corvallis OR, US
Kevin E Swier - Albany OR, US
Zhuqing Zhang - Corvallis OR, US

Assignee:

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. - Houston TX

International Classification:

B41J 2/19
B41J 2/14
B41J 2/175

Abstract:

In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

US Patent:

20160257117, Sep 8, 2016

Filed:

Oct 28, 2013

Appl. No.:

15/032022

Inventors:

- Houston TX, US
Michael W. Cumbie - Corvallis OR, US
Zhuqing Zhang - Corvallis OR, US

Assignee:

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. - Houston TX

International Classification:

B41J 2/14
H01L 21/56
H01L 23/00
H01L 21/67

Abstract:

Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.