Andrew A Noujaim

US Patent:

20210343512, Nov 4, 2021

Filed:

Apr 30, 2020

Appl. No.:

16/863719

Inventors:

- Santa Clara CA, US
Andreas SCHMID - Meyriez, CH
Andrew Antoine NOUJAIM - Morgan Hill CA, US
Stephen Donald PROUTY - San Jose CA, US
Alvaro GARCIA DE GORORDO - San Francisco CA, US
Martin PEREZ-GUZMAN - San Jose CA, US

International Classification:

H01J 37/32
H01L 21/67
H01L 21/683

Abstract:

A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.

US Patent:

20210296101, Sep 23, 2021

Filed:

Mar 20, 2020

Appl. No.:

16/825466

Inventors:

- Santa Clara CA, US
Alvaro GARCIA DE GORORDO - San Francisco CA, US
Andreas SCHMID - Meyriez, CH
Andrew Antoine NOUJAIM - Morgan Hill CA, US

International Classification:

H01J 37/32
H01L 21/683
H01L 21/67

Abstract:

Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

US Patent:

20210082730, Mar 18, 2021

Filed:

Aug 19, 2020

Appl. No.:

16/997300

Inventors:

- Santa Clara CA, US
Steven E. BABAYAN - Los Altos CA, US
Stephen Donald PROUTY - San Jose CA, US
Alvaro Garcia DE GORORDO - Mountain View CA, US
Andreas SCHMID - Meyriez, CH
Andrew Antoine NOUJAIM - Morgan Hill CA, US

International Classification:

H01L 21/683
H01J 37/32

Abstract:

Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

US Patent:

20200395197, Dec 17, 2020

Filed:

Jun 15, 2020

Appl. No.:

16/901797

Inventors:

- Santa Clara CA, US
Daniel Sang BYUN - Campbell CA, US
Andreas SCHMID - Meyriez, CH
Stephen Donald PROUTY - San Jose CA, US
Andrew Antoine NOUJAIM - Morgan Hill CA, US

International Classification:

H01J 37/32
H01L 21/683

Abstract:

Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.

US Patent:

20200185248, Jun 11, 2020

Filed:

Dec 11, 2018

Appl. No.:

16/217036

Inventors:

- Santa Clara CA, US
Steven E. BABAYAN - Los Altos CA, US
Stephen Donald PROUTY - San Jose CA, US
Álvaro GARCÍA DE GORORDO - Mountain View CA, US
Andreas SCHMID - Meyriez, CH
Andrew Antoine NOUJAIM - Morgan Hill CA, US

International Classification:

H01L 21/683
H01L 21/67

Abstract:

Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.