Andrew R Sparks

US Patent:

8058144, Nov 15, 2011

Filed:

May 19, 2009

Appl. No.:

12/468185

Inventors:

Milind Bhagavat - Medford MA, US
Erik Tarvin - South Boston MA, US
Firas Sammoura - Melrose MA, US
Kuang Yang - Newton MA, US
Andrew Sparks - Cambridge MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 21/46
C03B 29/00

US Classification:

438456, 156 8911, 65 31, 65 36, 65 42, 65 43, 65 58

Abstract:

A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.

US Patent:

8464571, Jun 18, 2013

Filed:

Mar 22, 2010

Appl. No.:

12/728867

Inventors:

Andrew Sparks - Cambridge MA, US
Michael Judy - Ipswich MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

G01P 21/00

US Classification:

73 138, 73 101, 702104

Abstract:

A calibration system for a MEMS system having at least one overdamped motion axis includes a measurement module for determining a location of a pole of a MEMS device in the overdamped motion axis, a closed-loop feedback system configured to change a first location of the pole to a second location of the pole, and a computation module for calculating a resonant frequency and/or a quality factor using the first and the second location of the pole as determined by the measurement module. The calibration system further includes a calibration module for calibrating the MEMS system based on the calculated resonant frequency and/or the calculated quality factor.

US Patent:

8498178, Jul 30, 2013

Filed:

Dec 13, 2011

Appl. No.:

13/324565

Inventors:

Christophe Antoine - Somerville MA, US
Andrew W. Sparks - Cambridge MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

B06B 1/02

US Classification:

367138

Abstract:

An array of acoustic transducing unit cells configured with an acoustic focus or a beam steering orientation. A variety of time delays between consecutively coupled acoustic transducing unit cells provides acoustic focus. In another configuration, a resistive signal path between adjacent acoustic transducing unit cells can be used to acoustically steer an acoustic beam in a direction non-normal to the top surface in which the array is disposed. In a further embodiment, a signal pad is made available at each end of the connections through an array of capacitive micromachined ultrasonic transducing unit cells.

US Patent:

8593155, Nov 26, 2013

Filed:

Aug 10, 2010

Appl. No.:

12/853619

Inventors:

Andrew Sparks - Cambridge MA, US
Milind Bhagavat - Medford MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

G01R 27/04

US Classification:

324633

Abstract:

MEMS in-plane resonators include a substrate wafer, at least one resonant mass supported by the substrate wafer and configured to resonate substantially in-plane, and at least one transducer coupled to the at least one resonant mass for at least one of driving and sensing in-plane movement of the at least one resonant mass, wherein at least part of one surface of the resonant mass is configured for exposure to an external environment and wherein the at least one transducer is isolated from the external environment. Such MEMS in-plane resonators may be fabricated using conventional surface micromachining techniques and high-volume wafer fabrication processes and may be configured for liquid applications (e. g. , viscometry, densitometry, chemical/biological sensing), gas sensing (e. g. , where a polymer film is added to the sensor surface, further degrading the damping performance), or other applications.

US Patent:

20060033024, Feb 16, 2006

Filed:

Jun 15, 2005

Appl. No.:

11/153300

Inventors:

Andrew Sparks - Cambridge MA, US
Scott Manalis - Cambridge MA, US

International Classification:

G01N 23/00

US Classification:

250306000

Abstract:

A method for inherently suppressing out-of-plane disturbances in scanning probe microscopy that facilitates higher resolution imaging, particularly in noisy environments.

US Patent:

20110284995, Nov 24, 2011

Filed:

May 20, 2011

Appl. No.:

13/112587

Inventors:

Jan H. Kuypers - Cambridge MA, US
Andrew Sparks - Cambridge MA, US
Klaus Juergen Schoepf - Chandler AZ, US
Reimund Rebel - Maricopa AZ, US

Assignee:

Sand9, Inc. - Cambridge MA

International Classification:

H01L 29/06
H01L 21/324
H01L 21/316

US Classification:

257622, 257618, 438770, 438795, 257E29022, 257E21283, 257E21211

Abstract:

Micromechanical membranes suitable for formation of mechanical resonating structures are described, as well as methods for making such membranes. The membranes may be formed by forming cavities in a substrate, and in some instances may be oxidized to provide desired mechanical properties. Mechanical resonating structures may be formed from the membrane and oxide structures.

US Patent:

20120006113, Jan 12, 2012

Filed:

Apr 20, 2011

Appl. No.:

13/091018

Inventors:

Guiti Zolfagharkhani - Brighton MA, US
Jan H. Kuypers - Cambridge MA, US
Alexei Gaidarzhy - Brighton MA, US
Andrew Sparks - Cambridge MA, US

Assignee:

SAND9, INC. - Cambridge MA

International Classification:

G01C 19/56

US Classification:

7350412

Abstract:

In one embodiment, an apparatus includes a resonant structure having a plate, a drive electrode and a sense electrode. The resonant structure defines an axis substantially orthogonal to a plane defined by the plate when the resonant structure is not excited. The plate is formed from a piezoelectric material. The drive electrode is configured to excite the resonant structure, and the sense electrode is configured to sense a signal in response to rotation of the resonant structure about the axis.

US Patent:

20120195797, Aug 2, 2012

Filed:

Jan 31, 2011

Appl. No.:

13/017247

Inventors:

Andrew Sparks - Cambridge MA, US
William D. Sawyer - Arlington MA, US

Assignee:

ANALOG DEVICES, INC. - Norwood MA

International Classification:

G01N 33/00
G01R 3/00
G01N 29/02

US Classification:

422 69, 73 2406, 29595

Abstract:

A MEMS sensor includes at least one closed nodal anchor along a predetermined closed nodal path on at least one surface of a resonant mass. The resonant mass may be configured to resonate substantially in an in-plane contour mode. Drive and/or sense electrodes may be disposed within a cavity formed at least in part by the resonant mass, the closed nodal anchor, and a substrate.