Brian P Stark

US Patent:

7449355, Nov 11, 2008

Filed:

Apr 27, 2005

Appl. No.:

11/115828

Inventors:

Markus Lutz - Palo Alto CA, US
Aaron Partridge - Palo Alto CA, US
Wilhelm Frey - Stuttgart, DE
Markus Ulm - Menlo Park CA, US
Matthias Metz - Palo Alto CA, US
Brian Stark - San Francisco CA, US
Gary Yama - Mountain View CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/00
H01L 21/461

US Classification:

438 50, 438 52, 438706

Abstract:

A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.

US Patent:

7563633, Jul 21, 2009

Filed:

Aug 25, 2006

Appl. No.:

11/510040

Inventors:

Markus Ulm - Wannweil, DE
Brian Stark - Los Altos CA, US
Matthias Metz - Palo Alto CA, US
Tino Fuchs - Tubingen, DE
Franz Laermer - Wailderstadt, DE
Silvia Kronmueller - Schwaikheim, DE

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/00

US Classification:

438 51, 438106, 438 55

Abstract:

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

US Patent:

7582514, Sep 1, 2009

Filed:

Aug 24, 2007

Appl. No.:

11/844844

Inventors:

Cyril Vancura - Palo Alto CA, US
Markus Ulm - Wannweil, DE
Brian Stark - San Francisco CA, US
Matthias Metz - Palo Alto CA, US
Tino Fuchs - Tubingen, DE
Franz Laermer - Weilder Stadt, DE
Silvia Kronmueller - Schwaikheim, DE

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/44

US Classification:

438127, 438125

Abstract:

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C. is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

US Patent:

7625773, Dec 1, 2009

Filed:

Nov 4, 2008

Appl. No.:

12/264774

Inventors:

Markus Lutz - Palo Alto CA, US
Aaron Partridge - Palo Alto CA, US
Wilhelm Frey - Stuttgart, DE
Markus Ulm - Menlo Park CA, US
Matthias Metz - Palo Alto CA, US
Brian Stark - San Francisco CA, US
Gary Yama - Mountain View CA, US

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/00
H01L 21/461
H01L 27/14
H01L 29/84
H01L 29/82

US Classification:

438 50, 438 52, 438706, 257414, 257415, 257417

Abstract:

A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure.

US Patent:

7671515, Mar 2, 2010

Filed:

Nov 7, 2006

Appl. No.:

11/594525

Inventors:

Matthias Metz - Palo Alto CA, US
Zhiyu Pan - Palo Alto CA, US
Brian Stark - Palo Alto CA, US
Markus Ulm - Wannweil, DE
Gary Yama - Palo Alto CA, US

Assignee:

Robert Bosch, GmbH - Stuttgart

International Classification:

H01L 41/053

US Classification:

310340, 310338, 310344

Abstract:

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.

US Patent:

7824943, Nov 2, 2010

Filed:

Jun 4, 2006

Appl. No.:

11/446851

Inventors:

Markus Lutz - Los Altos CA, US
Aaron Partridge - Cupertino CA, US
Brian H. Stark - San Francisco CA, US

Assignee:

Akustica, Inc. - Pittsburgh PA

International Classification:

H01L 21/00
H01L 21/76

US Classification:

438 48, 438 50, 438411, 438 51, 438 52, 438 53, 257E21192, 257E21247

Abstract:

Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplying, storing and/or trapping charge on the mechanical structure. In some aspects, a breakable link, a thermionic electron source and/or a movable mechanical structure are employed. The breakable link may comprise a fuse. In one embodiment, the movable mechanical structure is driven to resonate. In some aspects, the electrical charge enables a transducer to convert vibrational energy to electrical energy, which may be used to power circuit(s), device(s) and/or other purpose(s). In some aspects, the electrical charge is employed in changing the resonant frequency of a mechanical structure and/or generating an electrostatic force, which may be repulsive.

US Patent:

7898046, Mar 1, 2011

Filed:

Jul 20, 2009

Appl. No.:

12/506219

Inventors:

Markus Ulm - Wannweil, DE
Brian Stark - Los Altos CA, US
Matthias Metz - Palo Alto CA, US
Tino Fuchs - Tubingen, DE
Franz Laermer - Weilderstadt, DE
Silvia Kronmueller - Schwaikheim, DE

Assignee:

Robert Bosch GmbH - Stuttgart

International Classification:

H01L 21/00

US Classification:

257415, 257433

Abstract:

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.

US Patent:

8020266, Sep 20, 2011

Filed:

Jul 14, 2008

Appl. No.:

12/172369

Inventors:

Markus Ulm - Wannweil, DE
Brian Stark - Los Altos CA, US
Matthias Metz - Palo Alto CA, US

Assignee:

Robert Bosch Gmbh - Stuttgart

International Classification:

H01G 7/00

US Classification:

29 2542, 29595, 29856, 29858, 29885, 75414, 264434, 310330, 310331, 310332, 310339, 367160

Abstract:

Methods of making an energy harvesting device are described. A case and integrated piezoelectric cantilever to harvest vibration energy from an environment being sensed is produced via a print forming method injection molding method. The cantilever device consists of a piezoelectric material member, and a proof mass of high density material coupled to the piezoelectric member. The print forming method is used to build up the base and walls of the device as well as the neutral layers of the piezoelectric member. Metal layers are printed to form the electrode layers of the piezoelectric member and the electrical contact portions of the device. Passive components can also be formed as part of the layers of the device. The entire assembly can be encapsulated in plastic.