Chau H Duong

US Patent:

8272922, Sep 25, 2012

Filed:

Apr 23, 2008

Appl. No.:

12/055621

Inventors:

Chau H. Duong - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24B 1/00

US Classification:

451 41, 451 36

Abstract:

A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing performance are provided.

US Patent:

8512427, Aug 20, 2013

Filed:

Sep 29, 2011

Appl. No.:

13/248123

Inventors:

Jia Xie - Lake Jackson TX, US
David B. James - Newark DE, US
Chau H. Duong - Newark DE, US

Assignee:

Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE

International Classification:

B24D 3/28
B24D 15/00
B24D 18/00
C08G 18/67
C09K 3/14

US Classification:

51298, 451526, 451533, 451539, 522 90, 528 49, 528 61, 528 63, 528 64, 528 75

Abstract:

A chemical mechanical polishing pad comprising an acrylate polyurethane polishing layer, wherein the polishing layer exhibits a tensile modulus of 65 to 500 MPa; an elongation to break of 50 to 250%; a storage modulus, G′, of 25 to 200 MPa; a Shore D hardness of 25 to 75; and a wet cut rate of 1 to 10 μm/min.

US Patent:

20010041511, Nov 15, 2001

Filed:

Jan 19, 2001

Appl. No.:

09/766155

Inventors:

Craig Lack - Wilmington DE, US
Chau Duong - Newark DE, US
David James - Newark DE, US

International Classification:

B24B001/00

US Classification:

451/041000

Abstract:

A polishing pad includes a flexible substrate and a polymeric polishing layer that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing process.

US Patent:

20030194960, Oct 16, 2003

Filed:

Apr 10, 2002

Appl. No.:

10/119918

Inventors:

Eric Staudt - Jeffersonville PA, US
Chau Duong - Newark DE, US
John Roberts - Newark DE, US
Richard Levering - Hockessin DE, US

International Classification:

B24B021/00

US Classification:

451/296000, 451/533000

Abstract:

A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.

US Patent:

20050176251, Aug 11, 2005

Filed:

Feb 5, 2004

Appl. No.:

10/774656

Inventors:

Chau Duong - Newark DE, US

International Classification:

B44C001/22

US Classification:

438692000, 216089000

Abstract:

The present invention provides a polishing pad useful for polishing a semiconductor substrate, the polishing pad comprising: a polishing layer having a polishing surface, the polishing layer comprising particles disposed in a polymeric matrix, the particles being coated with a material having a surface tension of less than 50 dynes/cm, the coated particles being capable of releasing from the polishing surface during polishing.

US Patent:

20060202384, Sep 14, 2006

Filed:

Feb 14, 2006

Appl. No.:

11/354400

Inventors:

Chau Duong - Newark DE, US
David James - Newark DE, US

International Classification:

B29C 39/14
C09D 101/18
B29C 39/38

US Classification:

264216000, 524557000, 524502000, 524507000, 524031000, 264236000

Abstract:

The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof. The present invention provides a water-based polishing pad with reduced defectivity and improved polishing performance.

US Patent:

20070066195, Mar 22, 2007

Filed:

Aug 14, 2006

Appl. No.:

11/504415

Inventors:

Chau Duong - Newark DE, US

International Classification:

B24D 11/00

US Classification:

451526000

Abstract:

The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, and wherein the polymeric matrix is applied on a permeable substrate. The present invention provides a water-based polishing pad with reduced defectivity and improved polishing performance.

US Patent:

20080063856, Mar 13, 2008

Filed:

Sep 11, 2006

Appl. No.:

11/519578

Inventors:

Chau H. Duong - Newark DE, US

International Classification:

B32B 5/22

US Classification:

4283179, 521155, 428159, 428163

Abstract:

The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the pad comprises: a Shore A hardness of 30 to 70; a void volume fraction of 0.2 to 80 percent; a tensile strength of 1 mPa to 5 mPa; and a percent elongation of 200 to 400.