Ching Y Tsai

US Patent:

20060225870, Oct 12, 2006

Filed:

Apr 12, 2005

Appl. No.:

11/103678

Inventors:

Ching Tsai - Irvine CA, US
Julian Prabhu - Huntington Beach CA, US
Frank Shen - Rowland Heights CA, US

International Classification:

F28F 13/00

US Classification:

165135000

Abstract:

The present invention provides a cooling apparatus, system, and associated method. The cooling apparatus includes an insulating material, and a heat transfer device at least partially embedded within the structure material. The cooling apparatus also includes a diamond composite sheet positioned adjacent to the structure material, wherein the diamond composite sheet is in thermal communication with the heat transfer device.