Christopher L Bartlett

US Patent:

7690324, Apr 6, 2010

Filed:

Aug 9, 2005

Appl. No.:

11/200338

Inventors:

Jingbin Feng - Lake Oswego OR, US
Steven T. Mayer - Lake Oswego OR, US
Daniel Mark Dinneen - Portland OR, US
Edmund B. Minshall - Sherwood OR, US
Christopher M. Bartlett - Beaverton OR, US
Eric G. Webb - West Linn OR, US
R. Marshall Stowell - Wilsonville OR, US
Mark T. Winslow - Camas WA, US
Avishai Kepten - Lake Oswego OR, US
Norman D. Kaplan - Portland OR, US
Richard K. Lyons - Sandy OR, US
John B. Alexy - West Linn OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

B05C 11/02

US Classification:

118 52, 118731, 118429, 118423

Abstract:

During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.

US Patent:

8257781, Sep 4, 2012

Filed:

Aug 11, 2005

Appl. No.:

11/201709

Inventors:

Eric G. Webb - West Linn OR, US
Steven T. Mayer - Lake Oswego OR, US
David Mark Dinneen - Portland OR, US
Edmund B. Minshall - Sherwood OR, US
Christopher M. Bartlett - Beaverton OR, US
R. Marshall Stowell - Wilsonville OR, US
Mark T. Winslow - Camas WA, US
Avishai Kepten - Lake Oswego OR, US
Jingbin Feng - Lake Oswego OR, US
Norman D. Kaplan - Portland OR, US
Richard K. Lyons - Sandy OR, US
John B. Alexy - West Linn OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C23C 14/00

US Classification:

427 979, 427 995

Abstract:

A main reservoir holds cool reactant liquid. A reaction vessel for treating a substrate is connected to the main reservoir by a feed conduit. A heater is configured to heat reactant liquid in the feed conduit before the liquid enters the reaction vessel. Preferably, the heater is a microwave heater. A recycle conduit connects the reaction vessel with the main reservoir. Preferably, a recycle cooler cools reactant liquid in the recycle conduit before the liquid returns to the main reservoir. Preferably, an accumulation vessel is integrated in the feed conduit for accumulating, heating, conditioning and monitoring reactant liquid before it enters the reaction vessel. Preferably, a recycle accumulator vessel is integrated in the recycle conduit to accommodate reactant liquid as it empties out of the reaction vessel.

US Patent:

20110146571, Jun 23, 2011

Filed:

Dec 18, 2009

Appl. No.:

12/642497

Inventors:

Christopher M. Bartlett - Beaverton OR, US
Ming Li - West Linn OR, US
Jon Henri - West Linn OR, US
Marshall R. Stowell - Wilsonville OR, US
Mohammed Sabri - Beaverton OR, US

International Classification:

C23C 16/52
C23C 16/00

US Classification:

118667

Abstract:

A temperature controlled showerhead assembly for chemical vapor deposition (CVD) chambers enhances heat dissipation to provide accurate temperature control of the showerhead face plate and maintain temperatures substantially lower than surrounding components. Heat dissipates by conduction through a showerhead stem and removed by the heat exchanger mounted outside of the vacuum environment. Heat is supplied by a heating element inserted into the steam of the showerhead. Temperature is controlled using feedback supplied by a temperature sensor installed in the stem and in thermal contact with the face plate.

US Patent:

20170032510, Feb 2, 2017

Filed:

Jul 30, 2015

Appl. No.:

14/813948

Inventors:

- Fremont CA, US
Brandon Senn - Molalla OR, US
Peter Thaulad - San Jose CA, US
Zhuozhi Chen - Mountain View CA, US
Richard K. Lyons - Sandy OR, US
Christian DiPietro - Sherwood OR, US
Christopher M. Bartlett - Beaverton OR, US

International Classification:

G06T 7/00
H01L 21/68

Abstract:

A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.