Christopher Samuel Walton

US Patent:

6524449, Feb 25, 2003

Filed:

Dec 3, 1999

Appl. No.:

09/454673

Inventors:

James A. Folta - Livermore CA 94550
Claude Montcalm - Livermore CA 94550
Christopher Walton - Berkeley CA 94705-1852

International Classification:

C23C 1600

US Classification:

20419213, 20429803, 118663, 118664, 118665, 118730, 427 8, 427 9, 700116

Abstract:

A method and system for producing a thin film with highly uniform (or highly accurate custom graded) thickness on a flat or graded substrate (such as concave or convex optics), by sweeping the substrate across a vapor deposition source with controlled (and generally, time-varying) velocity. In preferred embodiments, the method includes the steps of measuring the source flux distribution (using a test piece that is held stationary while exposed to the source), calculating a set of predicted film thickness profiles, each film thickness profile assuming the measured flux distribution and a different one of a set of sweep velocity modulation recipes, and determining from the predicted film thickness profiles a sweep velocity modulation recipe which is adequate to achieve a predetermined thickness profile. Aspects of the invention include a practical method of accurately measuring source flux distribution, and a computer-implemented method employing a graphical user interface to facilitate convenient selection of an optimal or nearly optimal sweep velocity modulation recipe to achieve a desired thickness profile on a substrate. Preferably, the computer implements an algorithm in which many sweep velocity function parameters (for example, the speed at which each substrate spins about its center as it sweeps across the source) can be varied or set to zero.

US Patent:

6668207, Dec 23, 2003

Filed:

Nov 13, 2000

Appl. No.:

09/710957

Inventors:

Claude Montcalm - Livermore CA
James Allen Folta - Livermore CA
Christopher Charles Walton - Berkeley CA

Assignee:

The United States of America - Washington DC

International Classification:

G06F 1900

US Classification:

700121, 700116, 20419213

Abstract:

A method and system for determining a source flux modulation recipe for achieving a selected thickness profile of a film to be deposited (e. g. , with highly uniform or highly accurate custom graded thickness) over a flat or curved substrate (such as concave or convex optics) by exposing the substrate to a vapor deposition source operated with time-varying flux distribution as a function of time. Preferably, the source is operated with time-varying power applied thereto during each sweep of the substrate to achieve the time-varying flux distribution as a function of time. Preferably, the method includes the steps of measuring the source flux distribution (using a test piece held stationary while exposed to the source with the source operated at each of a number of different applied power levels), calculating a set of predicted film thickness profiles, each film thickness profile assuming the measured flux distribution and a different one of a set of source flux modulation recipes, and determining from the predicted film thickness profiles a source flux modulation recipe which is adequate to achieve a predetermined thickness profile. Aspects of the invention include a computer-implemented method employing a graphical user interface to facilitate convenient selection of an optimal or nearly optimal source flux modulation recipe to achieve a desired thickness profile on a substrate. The method enables precise modulation of the deposition flux to which a substrate is exposed to provide a desired coating thickness distribution.

US Patent:

7473301, Jan 6, 2009

Filed:

Sep 17, 2002

Appl. No.:

10/245218

Inventors:

Leonard Elliott Klebanoff - Dublin CA, US
Daniel John Rader - Albuquerque NM, US
Christopher Walton - Berkeley CA, US
James Folta - Livermore CA, US

Assignee:

EUV LLC - Santa Clara CA

International Classification:

B01D 45/08

US Classification:

95285, 55465, 55524, 55DIG 14

Abstract:

An efficient device for capturing fast moving particles has an adhesive particle shield that includes (i) a mounting panel and (ii) a film that is attached to the mounting panel wherein the outer surface of the film has an adhesive coating disposed thereon to capture particles contacting the outer surface. The shield can be employed to maintain a substantially particle free environment such as in photolithographic systems having critical surfaces, such as wafers, masks, and optics and in the tools used to make these components, that are sensitive to particle contamination. The shield can be portable to be positioned in hard-to-reach areas of a photolithography machine. The adhesive particle shield can incorporate cooling means to attract particles via the thermophoresis effect.

US Patent:

7957948, Jun 7, 2011

Filed:

Aug 22, 2007

Appl. No.:

11/895176

Inventors:

Kenneth C. Zink - Austin TX, US
Douglas M. Neuse - Austin TX, US
Christopher B. Walton - Austin TX, US

Assignee:

Hyperformit, Inc. - Austin TX

International Classification:

G06F 11/30
G06F 9/44
G06F 9/45
G06F 7/60
G06F 17/40
G06F 11/00
G06G 7/58

US Classification:

703 13, 703 2, 703 22, 702176, 702179, 702186, 702187, 702188, 710 18, 717103

Abstract:

A method for expressing a hierarchy of scalabilities in complex systems, including a discrete event simulation and an analytic model, for analysis and prediction of the performance of multi-chip, multi-core, multi-threaded computer processors is provided. Further provided is a capacity planning tool for migrating data center systems from a source configuration which may include source systems with multithreaded, multicore, multichip central processing units to a destination configuration which may include destination systems with multithreaded, multicore and multichip central processing units, wherein the destination systems may be different than the source systems. Apparatus and methods are taught for the assembling of and utilization of linear and exponential scalability factors in the capacity planning tool when a plurality of active processor threads populate processors with multiple chips, multiple cores per chip and multiple threads per core.

US Patent:

20030120798, Jun 26, 2003

Filed:

Dec 21, 2001

Appl. No.:

10/029679

Inventors:

Gregg Bouchard - Round Rock TX, US
Mauricio Calle - Austin TX, US
Joel Davidson - Austin TX, US
Michael Hathaway - Austin TX, US
James Kirk - Austin TX, US
Christopher Walton - Austin TX, US

International Classification:

G06F015/16

US Classification:

709/236000, 709/214000, 709/250000

Abstract:

A packet processing system comprises first processing circuitry for performing a first function, and first memory circuitry coupled to the first processing circuitry for storing received packets, wherein at least a portion of the packets stored by the first memory circuitry are usable by the first processing circuitry in accordance with the first function. The packet processing system further comprises at least second processing circuitry for performing a second function, and at least second memory circuitry coupled to the second processing circuitry for storing at least a portion of the same packets stored in the first memory circuitry, wherein at least a portion of the packets stored in the second memory circuitry are usable by the second processing circuitry in accordance with the second function. In an illustrative embodiment, the first processing circuitry and the second processing circuitry operate in a packet switching device such as a router. In such case, the first processing circuitry and the second processing circuitry operate between a packet network interface and a switch fabric of the packet switching device.

US Patent:

20040055871, Mar 25, 2004

Filed:

Sep 25, 2002

Appl. No.:

10/254119

Inventors:

Christopher Walton - Berkeley CA, US
James Folta - Livermore CA, US

Assignee:

The Regents of the University of California

International Classification:

C23C014/32

US Classification:

204/192110, 204/298040

Abstract:

A method and means are provided for actively protecting a substrate from particulate contamination during thin film deposition. An intense beam of ions or ionized clusters is directed through the space immediately in front of the surface being coated, and the kinetic energy of the ions is used to deflect any approaching particle defects to the side, preventing them from reaching the surface being coated.

US Patent:

20120130680, May 24, 2012

Filed:

Nov 22, 2010

Appl. No.:

12/927761

Inventors:

Kenneth C. Zink - Austin TX, US
Douglas M. Neuse - Austin TX, US
Christopher B. Walton - Austin TX, US

International Classification:

G06F 11/30
G06F 15/00

US Classification:

702186

Abstract:

A method for expressing a hierarchy of scalabilities in complex systems, including a discrete event simulation and an analytic model, for analysis and prediction of the performance of multi-chip, multi-core, multi-threaded computer processors is provided. Further provided is a capacity planning tool for migrating data center systems from a source configuration which may include source systems with multithreaded, multicore, multichip central processing units to a destination configuration which may include destination systems with multithreaded, multicore and multichip central processing units, wherein the destination systems may be different than the source systems. Apparatus and methods are taught for the assembling of and utilization of linear and exponential scalability factors in the capacity planning tool when a plurality of active processor threads populate processors with multiple chips, multiple cores per chip and multiple threads per core.

US Patent:

20220385106, Dec 1, 2022

Filed:

Aug 10, 2022

Appl. No.:

17/885231

Inventors:

- Cupertino CA, US
Timothy J. Rasmussen - San Jose CA, US
Demetrios B. Karanikos - San Francisco CA, US
Christopher J. Walton - Sunnyvale CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H02J 50/10
H02J 50/00

Abstract:

Wireless chargers that can properly align and securely hold an electronic device, provide power to more than one electronic device, and fold into a compact shape. One example can provide a wireless charger having an alignment feature to align an electronic device to the wireless charger. The wireless charger can include a first leaf having first charging components for charging a first electronic device and a second leaf having a charging puck that includes second charging components for charging a second electronic device. The charging puck can move between a down position and an up position. The charging puck can be moved away from the second leaf while in the up position. The charging puck can retract when moved to the down position. The first leaf and the second leaf can fold together into a compact shape.