Dat Van Duong

US Patent:

20080185705, Aug 7, 2008

Filed:

Aug 23, 2007

Appl. No.:

11/895191

Inventors:

Philip R. Osborn - San Jose CA, US
Belgacem Haba - Saratoga CA, US
Ellis Chau - San Jose CA, US
Giles Humpston - Aylesbury, GB
Masud Beroz - San Jose CA, US
Dat Nghe Duong - San Jose CA, US
Jae M. Park - San Jose CA, US
Jesse Burl Thompson - Brentwood CA, US
Richard Dewitt Crisp - Castro Valley CA, US

Assignee:

Tessera, Inc. - San Jose CA

International Classification:

H01L 23/48

US Classification:

257690, 257E23169

Abstract:

A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.