David P Stark

US Patent:

6627814, Sep 30, 2003

Filed:

Mar 22, 2002

Appl. No.:

10/104315

Inventors:

David H. Stark - Evergreen CO 80439

International Classification:

H05K 506

US Classification:

174 523, 174 524, 257680, 295921

Abstract:

A method for manufacturing a cover assembly including a transparent window portion and a frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. First, a frame is provided having a continuous sidewall defining a frame aperture therethrough. The sidewall includes a frame seal-ring area circumscribing the frame aperture. The frame seal-ring area has a metallic surface. A sheet of a transparent material is provided having a window portion defined thereupon. The window portion has finished top and bottom surfaces. Next, a sheet seal-ring area on the sheet is prepared, the sheet seal-ring area circumscribing the window portion. Next, the prepared sheet seal-ring area of the sheet is metallized. Next, the frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. Next, the junction region is heated until a metal-to-metal joint is formed between the frame and sheet all along the junction region, whereby a hermetic seal circumscribing the window portion is formed.

US Patent:

6723379, Apr 20, 2004

Filed:

Apr 26, 2002

Appl. No.:

10/133049

Inventors:

David H. Stark - Evergreen CO 80439

International Classification:

B05D 112

US Classification:

427180, 427190, 427191, 427192, 427199, 427 96, 427108, 427110

Abstract:

A method for manufacturing a cover assembly including a transparent window portion and a metallic frame that can be joined to a micro-device package base to form a hermetically sealed micro-device package. A sheet of a transparent material is provided having a window portion defined thereupon, the window portion having finished top and bottom surfaces. A frame-attachment area is prepared on the sheet, the frame-attachment area circumscribing the window portion. A first quantity of powdered metal particles is sprayed onto the prepared frame-attachment area of the sheet using a jet of gas, the gas being at a temperature below the fusing temperature of the metal particles. The jet of gas has a velocity sufficient to cause the metal particles to merge with one another upon impact with the sheet and with one another so as to form an initial continuous metallic coating adhering to the frame-attachment area of the sheet. Successive quantities of powdered metal particles are applied over the initial continuous metallic coating using the jet of gas so as to form a continuous built-up metallic frame incorporating the initial continuous metallic coating as its base and having an overall thickness that is a predetermined thickness.

US Patent:

6759590, Jul 6, 2004

Filed:

Jul 30, 2003

Appl. No.:

10/630291

Inventors:

David H. Stark - Evergreen CO 80439

International Classification:

H05K 506

US Classification:

174 523, 174 524, 257680, 257704, 295921

Abstract:

A method for manufacturing a cover assembly including a transparent window portion and a frame of gas-impervious material that can be hermetically attached to a micro-device package base to form a hermetically sealed micro-device package. First, a frame of gas-impervious material is provided, the frame having a continuous sidewall defining a frame aperture there through. The sidewall includes a frame seal-ring area circumscribing the frame aperture. A sheet of a transparent material is also provided, the sheet having a window portion defined thereupon. The window portion has finished top and bottom surfaces. A sheet seal-ring area is prepared on the sheet, the sheet seal-ring area circumscribing the window portion. The frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. The frame is pressed against the sheet with sufficient force to produce a predetermined contact pressure between the frame seal-ring area and the sheet seal-ring area along the junction region.

US Patent:

6924974, Aug 2, 2005

Filed:

Feb 16, 2004

Appl. No.:

10/780172

Inventors:

David H. Stark - Evergreen CO, US

International Classification:

G06F001/16

US Classification:

361679, 174 524, 257680, 439 83

Abstract:

A cover assembly for welding to a package base to form a hermetically sealed micro-device package. The cover assembly includes a sheet of a transparent material having a window portion. A built-up metallic frame adheres to the sheet and circumscribes the window portion, the frame having been deposited as follows: First, powdered metal particles are sprayed onto a prepared area of the sheet using a gas jet at a temperature below the fusing temperature of the particles, the jet having a velocity sufficient to cause the particles to merge with one another upon impact with the sheet and with one another to form an initial continuous metallic coating adhering to the prepared area of the sheet. Next, successive metal particles are applied over the initial coating using the jet to form the frame incorporating the initial continuous metallic coating as its base and having an predetermined overall thickness.

US Patent:

6962834, Nov 8, 2005

Filed:

Nov 14, 2003

Appl. No.:

10/713475

Inventors:

David H. Stark - Evergreen CO, US

International Classification:

H01L021/44

US Classification:

438107, 438116

Abstract:

A method for manufacturing a hermetically sealed micro-device package encapsulating a micro-device. The package includes a transparent window allowing light to pass into and out of a cavity containing the micro-device. A first frame-attachment area is prepared on semiconductor substrate having a micro-device operably disposed thereupon, the first frame-attachment area having a plan that circumscribes the micro-device. A second frame-attachment area is prepared on a sheet of transparent material, the second frame-attachment area having a plan that circumscribes a window aperture portion of the sheet. A frame/spacer is positioned between the semiconductor substrate and the sheet, the frame/spacer including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of the first frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device. Next the substrate, frame/spacer and window are bonded together to form a hermetically sealed package encapsulating the micro-device in a cavity below the window aperture portion of the transparent sheet.

US Patent:

7122719, Oct 17, 2006

Filed:

Nov 2, 2001

Appl. No.:

10/415759

Inventors:

Salim M. Hakimi - West Des Moines IA, US
Bradley M. Krohn - Ballwin MO, US
David M. Stark - Chesterfield MO, US

Assignee:

Monsanto Technology LLC - St. Louis MO

International Classification:

C12N 15/09
C12N 15/29
C12N 15/82
A01H 5/00
A01H 5/10

US Classification:

800279, 800278, 8003172, 800298, 800295, 435468, 435419

Abstract:

The present invention relates to a method for enhancing a plant's resistance to diseases and/or bruising by transforming the plant with sense and antisense polyphenol oxidase encoding sequences from potato. The invention also relates to transgenic plants and progeny thereof with reduced polyphenol oxidase activity.

US Patent:

7238546, Jul 3, 2007

Filed:

Jun 29, 2004

Appl. No.:

10/880166

Inventors:

David H. Stark - Evergreen CO, US

International Classification:

H01L 21/00

US Classification:

438106, 438116

Abstract:

A method for manufacturing a cover assembly including a transparent window portion and a frame of gas-impervious material that can be hermetically attached to a micro-device package base to form a hermetically sealed micro-device package. First, a frame of gas-impervious material is provided, the frame having a continuous sidewall defining a frame aperture there through. The sidewall includes a frame seal-ring area circumscribing the frame aperture. A sheet of a transparent material is also provided, the sheet having a window portion defined thereupon. The window portion has finished top and bottom surfaces. A sheet seal-ring area is prepared on the sheet, the sheet seal-ring area circumscribing the window portion. The frame is positioned against the sheet such that at least a portion of the frame seal-ring area and at least a portion of the sheet seal-ring area contact one another along a continuous junction region that circumscribes the window portion. The frame is pressed against the sheet with sufficient force to produce a predetermined contact pressure between the frame seal-ring area and the sheet seal-ring area along the junction region.

US Patent:

7517712, Apr 14, 2009

Filed:

Nov 8, 2005

Appl. No.:

11/269140

Inventors:

David H. Stark - Evergreen CO, US

Assignee:

Electronics Packaging Solutions, Inc. - Evergreen CO

International Classification:

H01L 21/00

US Classification:

438 51, 438 55, 438 64, 257E21499

Abstract:

A method for manufacturing a hermetically sealed micro-device package encapsulating a micro-device. The package includes a transparent window allowing light to pass into and out of a cavity containing the micro-device. A first frame-attachment area is prepared on semiconductor substrate having a micro-device operably disposed thereupon, the first frame-attachment area having a plan that circumscribes the micro-device. A second frame-attachment area is prepared on a sheet of transparent material, the second frame-attachment area having a plan that circumscribes a window aperture portion of the sheet. A frame/spacer is positioned between the semiconductor substrate and the sheet, the frame/spacer including a continuous sidewall having a plan on one side substantially corresponding to, and substantially in register with, the plan of the first frame-attachment area, having a plan on the opposite side substantially corresponding to, and substantially in register with, the plan of the second frame-attachment area, and having a height that exceeds the height of the micro-device. Next the substrate, frame/spacer and window are bonded together to form a hermetically sealed package encapsulating the micro-device in a cavity below the window aperture portion of the transparent sheet.