Deborah I Sylvester

US Patent:

7394659, Jul 1, 2008

Filed:

Nov 19, 2004

Appl. No.:

10/991987

Inventors:

Evan George Colgan - Chestnut Ridge NY, US
Gary Goth - Pleasant Valley NY, US
Deborah Anne Sylvester - Poughkeepsie NY, US
Jeffrey Allen Zitz - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20
H01L 23/367

US Classification:

361718, 361717, 361719, 257706, 257707, 257713

Abstract:

The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e. g. , copper thermal hat or lid) using a compliant thermally conductive material (e. g. , thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

US Patent:

7803664, Sep 28, 2010

Filed:

May 5, 2008

Appl. No.:

12/115332

Inventors:

Evan George Colgan - Chestnut Ridge NY, US
Gary Goth - Pleasant Valley NY, US
Deborah Anne Sylvester - Poughkeepsie NY, US
Jeffrey Allen Zitz - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/00
H01L 23/34
H01L 23/367

US Classification:

438122, 438118, 257712, 257E23104

Abstract:

The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e. g. , copper thermal hat or lid) using a compliant thermally conductive material (e. g. , thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.