Search

Edward J Dombroski

age ~88

from Jericho, VT

Also known as:
  • Edward J Dumbroski
  • Edw J Dombroski
  • Edward I
Phone and address:
509 Orr Rd, Jericho, VT 05465
(802)8992473

Edward Dombroski Phones & Addresses

  • 509 Orr Rd, Jericho, VT 05465 • (802)8992473

Work

  • Company:
    Travers | Dombroski PC
  • Address:

Specialities

Civil Rights • Domestic Relations • Divorce • Child Custody • Matrimonial Law • Domestic Partnerships

Us Patents

  • Stackable Vertical Thin Package/Plastic Molded Lead-On-Chip Memory Cube

    view source
  • US Patent:
    54570719, Oct 10, 1995
  • Filed:
    Sep 3, 1993
  • Appl. No.:
    8/116320
  • Inventors:
    Edward J. Dombroski - Jericho VT
  • Assignee:
    International Business Machine Corp. - Armonk NY
  • International Classification:
    H01L 2160
  • US Classification:
    437217
  • Abstract:
    This is a semiconductor chip package configuration particularly suited for stacking. These described arrangement is especially adapted to be used with the so-called Lead-On-Chip type package. Each package is of minimum size, and provided with a thermal heat sink arranged with respect to the remainder of the package to balance the stresses induced in the package during fabrication. This is accomplished by placing a lead frame on the active face of the semiconductor chip, bonding the lead frame conductors to respective input/output pads on the active face of the chip, and molding an encapsulant completely around five of the six sides of the chip but leaving a substantial portion of the sixth side unencapsulated. A heat sink is affixed on the exposed, i. e. unencapsulated, portion of the sixth side of the chip.
  • Tape Application Platform And Processes Therefor

    view source
  • US Patent:
    56613369, Aug 26, 1997
  • Filed:
    May 3, 1994
  • Appl. No.:
    8/237025
  • Inventors:
    Douglas Wallace Phelps - Burlington VT
    Edward John Dombroski - Jericho VT
    William Carroll Ward - Burlington VT
  • International Classification:
    H01L 23495
  • US Classification:
    257668
  • Abstract:
    A platform serves to carry an integrated circuit chip (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the IC chip in its use environment. The platform base (10) has a flat portion which may have a slot (30) passing through it and extending approximately the length of an IC chip (which has wire-bond pads (140), some of which may be near a chip axis). The IC chip is mounted to the platform base with tape (50), which provides at least one adhesive surface. The tape may be a cast or contained adhesive or epoxy with or without a backing layer, or it may be a thermoplastic or thermo-setting plastic. TAB or wire-bond pads are aligned with respect to the platform slot. If the chip has more than one row of wire-bond pads, the platform may have more than one slot. If more than one chip is mounted to the platform, the platform's base may have one or more slots (30, 40) per chip.
  • Tape Application Platform And Processes Therefor

    view source
  • US Patent:
    60435577, Mar 28, 2000
  • Filed:
    Aug 24, 1998
  • Appl. No.:
    9/138961
  • Inventors:
    Douglas Wallace Phelps - Burlington VT
    Edward John Dombroski - Jericho VT
    William Carroll Ward - Burlington VT
  • International Classification:
    H01L 23495
  • US Classification:
    257668
  • Abstract:
    A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry.
  • Tape Application Platform And Processes Therefor

    view source
  • US Patent:
    58893202, Mar 30, 1999
  • Filed:
    Apr 21, 1997
  • Appl. No.:
    8/843779
  • Inventors:
    Douglas Wallace Phelps - Burlington VT
    Edward John Dombroski - Jericho VT
    William Carroll Ward - Burlington VT
  • International Classification:
    H01L 2304
    H01L 23495
  • US Classification:
    257698
  • Abstract:
    A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry.
  • Tape Bonded Semiconductor Device

    view source
  • US Patent:
    49125478, Mar 27, 1990
  • Filed:
    Jan 30, 1989
  • Appl. No.:
    7/303207
  • Inventors:
    James A. Bilowith - Colchester VT
    Edward J. Dombroski - Jericho VT
    William H. Guthrie - Essex Junction VT
    Richard W. Noth - Fairfax VT
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01L 2312
    H01L 2348
    H01L 2302
  • US Classification:
    357 80
  • Abstract:
    Multiple, single conductor, tape automated bonding (TAB) tapes are sequentially applied to a semiconductor device by the bonding of a first, etched, single layer TAB tape to an outer row of bonding pads on a semiconductor chip and to selected contacts on a lead frame followed by the laying down of at least one additional etched, single layer TAB tape which is then bonded to an inner row of bonding pads on the semiconductor chip and to different selected lead frame contacts. If desired the subsequent TAB tape may be adhered to the preceding TAB tape to increase the mechanical strength of all the tapes and improve the electrical characteristics of the tapes. The application of one or more ground planes to the assembly is also shown.
  • Tape Application Platform And Processes Therefor

    view source
  • US Patent:
    56960328, Dec 9, 1997
  • Filed:
    Dec 30, 1996
  • Appl. No.:
    8/774540
  • Inventors:
    Douglas Wallace Phelps - Burlington VT
    Edward John Dombroski - Jericho VT
    William Carroll Ward - Burlington VT
  • International Classification:
    H01L 2160
  • US Classification:
    437209
  • Abstract:
    An integrated-circuit manufacturing process uses a platform to carry an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, to provide interconnections, and to support the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals.
  • Stackable Vertical Thin Package/Plastic Molded Lead-On-Chip Memory Cube

    view source
  • US Patent:
    55436609, Aug 6, 1996
  • Filed:
    Sep 22, 1994
  • Appl. No.:
    8/310521
  • Inventors:
    Edward J. Dombroski - Jericho VT
  • Assignee:
    International Business Machines Corp. - Armonk NY
  • International Classification:
    H01L 2310
    H01L 2334
  • US Classification:
    257707
  • Abstract:
    This is a semiconductor chip package configuration particularly suited for stacking. These described arrangement is especially adapted to be used with the so-called Lead-On-Chip type package. Each package is of minimum size, and provided with a thermal heat sink arranged with respect to the remainder of the package to balance the stresses induced in the package during fabrication. This is accomplished by placing a lead frame on the active face of the semiconductor chip, bonding the lead frame conductors to respective input/output pads on the active face of the chip, and molding an encapsulant completely around five of the six sides of the chip but leaving a substantial portion of the sixth side unencapsulated. A heat sink is affixed on the exposed, i. e. unencapsulated, portion of the sixth side of the chip.

Lawyers & Attorneys

Edward Dombroski Photo 1

Edward Dombroski - Lawyer

view source
Office:
Travers | Dombroski PC
Specialties:
Civil Rights
Domestic Relations
Divorce
Child Custody
Matrimonial Law
Domestic Partnerships
ISLN:
917112964
Admitted:
2002
University:
Union College, B.A., 1998; Union College, B.A., 1998; Union College, M.B.A., 1999
Law School:
Boston University School of Law, J.D., 2002

Resumes

Edward Dombroski Photo 2

General Manager

view source
Location:
31 Orr Rd, Jericho, VT 05465
Industry:
Recreational Facilities And Services
Work:
A.o Sherman
General Manager

Ibm Feb 1967 - Feb 1994
Semiconductor Packaging Engineer

Smugglers' Notch Resort Feb 1967 - Feb 1994
Professional Ski Instructor and Hiking Guide

Ge Jun 1960 - Feb 1967
Equipment Development Engineer
Education:
Thunderbird School of Global Management 1977 - 1978
Skills:
Ski
Edward Dombroski Photo 3

Professional Ski Instructor And Hiking Guide At Smugglers' Notch Resort

view source
Location:
Burlington, Vermont Area
Industry:
Recreational Facilities and Services

Classmates

Edward Dombroski Photo 4

Edward Dombroski Schenec...

view source
Edward Dombroski 1998 graduate of Schenectady High School in Schenectady, NY is on Classmates.com. Get caught up with Edward and other high school alumni ...
Edward Dombroski Photo 5

St. Ambrose School, Latha...

view source
Graduates:
Laurie Sauter (1978-1982),
Brittany Freeman (1998-2002),
Jack Styczynski (1973-1980),
Edward Dombroski (1986-1990),
Connie Sweeney (1970-1976)

Facebook

Edward Dombroski Photo 6

Edward Dombroski

view source
Friends:
Stefanie McBride, Theresa Gordon, Kenneth Erickson, Abigail Margaret Ketzenberg
Edward Dombroski Photo 7

Edward Dombroski

view source
Edward Dombroski Photo 8

Edward Dombroski

view source

Mylife

Edward Dombroski Photo 9

Edward Dombroski Plainvi...

view source
View Edward Dombroski's profile. Use our people search engine to find old friends like Edward at MyLife.

Youtube

Old lady or man (yet to be determined) angry ...

Phone number: (352)637-3215 Edward Dombroski of Inverness, Florida 609...

  • Category:
    Entertainment
  • Uploaded:
    13 Jul, 2010
  • Duration:
    21s

Massachusetts 5th Middlesex State Senate Debate

... Lewis (D-Winchester) and challenger Wakefield Town Councilor Edwar...

  • Duration:
    1h 16m 10s

The Power to Heal: Sister Mary Agnes Dombrosk...

The Power to Heal Sister Mary Agnes Dombroski entered the convent in 1...

  • Duration:
    15m 26s

Massachusetts Senate 5th Middlesex District D...

Massachusetts Senate 5th Middlesex District debate with candidates Jas...

  • Duration:
    1h 1m 18s

cant stop the feelin' - PCTI music video

Directed by Edward Dombroski Edited by Andrea Bonilla Shot by Edward D...

  • Duration:
    3m 57s

Can't Stop The Feelin - Pcti Dance Academy Mu...

... school's theme: Can't Stop The Feelin Directed by: Edward Dombrosk...

  • Duration:
    4m 1s

ON THE ROAD - MONMOUTH - With the Four Aces -...

SUBSCRIBE - youtube.com/NJCo... FOLLOW - instagram.com/nj... twitter...

  • Duration:
    5m 30s

Joe Dombroski At ELEVATE! Summer 2022

Mr. D has an amazing keynote lined up for you as part of our virtual e...

  • Duration:
    1m 8s

Get Report for Edward J Dombroski from Jericho, VT, age ~88
Control profile