A method for fabricating optical devices on a reusable handle substrate. The method includes providing a handle substrate having a surface region. The method also includes forming a plurality of optical device using at least an epitaxial growth process overlying the surface region and then releasing the handle substrate from the plurality of optical devices. The method reuses the handle substrate for another fabrication process.
Frank Tin Chung Shum - Sunnyvale CA, US Clifford Jue - Santa Cruz CA, US
Assignee:
Soraa, Inc. - Fremont CA
International Classification:
G05F 1/00 F21S 4/00
US Classification:
315291, 36224901
Abstract:
A method for forming a light source includes receiving an LED light module having a plurality of LEDs on a silicon substrate coupled to a flexible printed circuit and bonding the LED light module directly to a heat-sink with a thermal adhesive A base module with LED driver circuits is inserted into an interior channel of the heat sink and contacts of the LED driver circuits are connected to the LED light module.
Frank Tin Chung Shum - Sunnyvale CA, US Clifford Jue - Santa Cruz CA, US
Assignee:
Soraa, Inc. - Fremont CA
International Classification:
H01J 61/52
US Classification:
313 46, 362294
Abstract:
An illumination source includes a heat sink with a planar inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is affixed to the planar substrate and an adhesive layer between the planar substrate and the planar inner core region conducts heat from the LED assembly to the inner core region.
Frank Tin Chung Shum - Sunnyvale CA, US Clifford Jue - Santa Cruz CA, US
Assignee:
Soraa, Inc. - Fremont CA
International Classification:
G05F 1/00 F21S 4/00
US Classification:
315291, 36224901
Abstract:
A light source manufacturing method includes disposing LEDs upon a substrate having input pads for receiving an operating voltage for the LEDs, bonding a flexible PC board to the substrate, and using a thermally conductive adhesive bonding the substrate onto a planar region of a heat sink.
Frank Tin Chung Shum - Sunnyvale CA, US Clifford Jue - Santa Cruz CA, US
Assignee:
Soraa, Inc. - Fremont CA
International Classification:
H01J 1/02
US Classification:
313 46, 362294, 445 23
Abstract:
A illumination source includes a LED assembly and an MR-16 form factor heat sink coupled to the LED assembly. The MR-16 form factor heat sink has an inner core region and an outer core region with the LED assembly disposed upon the inner core region, and the outer core region providing a heat sink.
A method of manufacturing LED devices using substrate scale processing includes providing a substrate member having a surface region. A reflective layer is disposed on the surface region, the reflective surface having a reflectivity of at least 85%, An array of conductive regions is spatially disposed on the reflective surface. LED devices are affixed to each of the array regions.
Reflection Mode Package For Optical Devices Using Gallium And Nitrogen Containing Materials
Troy Anthony Trottier - Fremont CA, US Michael Ragan Krames - Los Altos CA, US Rajat Sharma - Fremont CA, US Frank Tin Chung Shum - Sunnyvale CA, US Rakesh Venkatesh - Oakland CA, US
Assignee:
Soraa, Inc. - Fremont CA
International Classification:
H01L 33/08 B82Y 99/00 B82Y 20/00
US Classification:
257 89, 977774, 977950, 257E33005
Abstract:
An optical device includes an LED formed on a substrate and a wavelength conversion material, which may be stacked or pixilated, within vicinity of the LED. A wavelength selective surface blocks direct emission of the LED device and transmits selected wavelengths of emission caused by an interaction with the wavelength conversion material.
Quantum Dot Wavelength Conversion For Hermetically Sealed Optical Devices