Henry Nguyen

US Patent:

7663939, Feb 16, 2010

Filed:

May 30, 2006

Appl. No.:

11/442818

Inventors:

Henry Nguyen - Fountain Valley CA, US
Ngoc Le - Irvine CA, US

Assignee:

Kingston Technology Corporation - Fountain Valley CA

International Classification:

G11C 7/00

US Classification:

36518911, 365222

Abstract:

A memory module is disclosed. The memory module comprises a voltage supply; a memory interface coupled to the voltage supply; a plurality of memory components; and a voltage stabilizer converter (VSC) coupled to the memory interface and to the plurality of memory components, the VSC for ensuring that the plurality of memory components operate at their optimum performance level. A voltage stabilizer memory module (VSMM) in accordance with the present invention includes a printed circuit board (PCB) that contains memory chips, discrete components, a voltage stabilizer converter, and other related components. The voltage stabilizer converter uses system voltage supply as its input and its output is the voltage supply for the DRAM components. Accordingly, the VSSM is more adaptable, more stable and has better performance than conventional memory modules.

US Patent:

8433706, Apr 30, 2013

Filed:

May 18, 2011

Appl. No.:

13/110764

Inventors:

Geoffrey Wade - Irvine CA, US
Mark Reyes - Irvine CA, US
Henry Nguyen - Irvine CA, US
Christopher Ploski - Irvine CA, US

Assignee:

Digital Map Products, Inc. - Irvine CA

International Classification:

G06F 7/00
G06F 17/30

US Classification:

707723, 707748, 707752

Abstract:

Systems and methods for customizing the display of a set of data using a preference stack interface. The preference stack interface allows a user to interact with an ordered list of criterion objects. Each criterion object corresponds to an attribute of the data set to be presented to the user. In response to a change in the order of the criterion objects in the preference stack, a rendering of the dataset can be updated to differently and visually emphasize items according to which criterion objects each item meets.

US Patent:

20060267172, Nov 30, 2006

Filed:

May 24, 2005

Appl. No.:

10/908718

Inventors:

Henry Nguyen - Fountain Valley CA, US
Mark Burlington - Aliso Viejo CA, US

Assignee:

KINGSTON TECHNOLOGY CORP. - Fountain Valley CA

International Classification:

H01L 23/02

US Classification:

257681000

Abstract:

A memory module substrate printed-circuit board (PCB) has multi-type footprints and an edge connector for mating with a memory module socket on a motherboard. Two or more kinds of dynamic-random-access memory (DRAM) chips with different data I/O widths can be soldered to solder pads around the multi-type footprints. When ×4 DRAM chips with 4 data I/O pins are soldered over the multi-type footprints, the memory module has a rank-select signal that drives chip-select inputs to all DRAM chips. When ×8 DRAM chips with 8 data I/O pins are soldered over the multi-type footprints, the memory module has two rank-select signals. One rank-select drives chip-select inputs to front-side DRAM chips while the second rank-select drives chip-select inputs to back-side DRAM chips. Wiring traces on the PCB cross-over data nibbles between the solder pads and the connector to allow two ×4 chips to drive a byte driven by only one ×8 chip.