Hong Zhen Dong

US Patent:

8377550, Feb 19, 2013

Filed:

Dec 29, 2009

Appl. No.:

12/655366

Inventors:

Rajasekaran Swaminathan - Chandler AZ, US
Hong Dong - Chandler AZ, US
Sandeep Razdan - Chandler AZ, US
Rahul Manepalli - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B32B 27/20
B32B 15/092

US Classification:

428331, 428418, 428457

Abstract:

Methods and associated structures of forming underfill material are described. Those methods may include applying an underfill to an interconnect structure comprising residue from a no clean flux, wherein the underfill comprises at least one of a functionalized nanofiller and a micron-sized filler.

US Patent:

20120074597, Mar 29, 2012

Filed:

Sep 24, 2010

Appl. No.:

12/890545

Inventors:

Dingying Xu - Maricopa AZ, US
Nisha Ananthakrishnan - Chandler AZ, US
Hong Dong - Perry Hall MD, US
Rahul N. Manepalli - Chandler AZ, US
Nachiket Raravikar - Gilbert AZ, US
Gregory S. Constable - Chandler AZ, US

International Classification:

H01L 23/48
C09D 7/12

US Classification:

257783, 10628714, 257E2301

Abstract:

Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.

US Patent:

20150284503, Oct 8, 2015

Filed:

Jun 22, 2015

Appl. No.:

14/746750

Inventors:

- Santa Clara CA, US
Nisha ANANTHAKRISHNAN - Chandler AZ, US
Hong DONG - Perry Hall MD, US
Rahul N. MANEPALLI - Chandler AZ, US
Nachiket R. RARAVIKAR - Gilbert AZ, US
Gregory S. CONSTABLE - Chandler AZ, US

International Classification:

C08G 59/02
C07F 7/08

Abstract:

Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.