Hong Jiang

US Patent:

8617427, Dec 31, 2013

Filed:

Oct 22, 2009

Appl. No.:

12/675623

Inventors:

Hong Jiang - Irvine CA, US
Aziz S. Shaikh - San Diego CA, US

Assignee:

Heraeus Precious Metals North America Conshohocken LLC - West Conshohocken PA

International Classification:

H01B 1/22

US Classification:

252514, 252512, 524439, 524495

Abstract:

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250 C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.

US Patent:

20090323807, Dec 31, 2009

Filed:

Jun 30, 2008

Appl. No.:

12/215861

Inventors:

Nicholas Mastronarde - Los Angeles CA, US
Hong Jiang - El Dorado Hills CA, US

International Classification:

H04N 7/32

US Classification:

37524015, 375E07125

Abstract:

A video encoder may analyze whether or not to do bidirectional or fractional motion estimation dependent on the cost in terms of bits needed to do the motion estimation versus the benefit of the analysis in terms of distortion, in some embodiments.

US Patent:

20120178207, Jul 12, 2012

Filed:

Jan 3, 2012

Appl. No.:

13/342334

Inventors:

Hong Jiang - Irvine CA, US
Chandrashekhar S. Khadilkar - Broadview Heights OH, US
Nazarali Merchant - San Diego CA, US
Srinivasan Sridharan - Strongsville OH, US
Aziz S. Shaikh - San Diego CA, US

Assignee:

FERRO CORPORATION - Mayfield Heights OH

International Classification:

H01L 31/18

US Classification:

438 98, 257E3111

Abstract:

Al pastes with additives of Co, Sr, V, compounds thereof and combinations thereof improve both the physical integrity of a back contact of a silicon solar cell as well as the electrical performance of a cell with such a contact.

US Patent:

20140008112, Jan 9, 2014

Filed:

Sep 28, 2011

Appl. No.:

13/877713

Inventors:

Hong Jiang - Irvine CA, US
Aziz S. Shaikh - San Diego CA, US

International Classification:

H01B 1/02
H01L 21/64

US Classification:

174257, 252514, 252503, 427 74

Abstract:

Electrically conductive polymeric compositions curable at temperatures below 250 C. are disclosed. The compositions are particularly well suited for forming electrodes used in association with certain solar cells.

US Patent:

20220348602, Nov 3, 2022

Filed:

May 8, 2020

Appl. No.:

17/608802

Inventors:

- Cambridge MA, US
- Tokyo, JP
Firoz Antia - Cambridge MA, US
Yannick Fillon - Cambridge MA, US
Xuan Zhou - Cambridge MA, US
Wuming Yan - Cambridge MA, US
Hong Jiang - Cambridge MA, US
Hien Nguyen - Cambridge MA, US
Robert S. Gronke - Cambridge MA, US
Taisuke Ichimaru - Kawasaki, JP
Takuya Hamagaki - Kawasaki, JP
Daisuke Takahashi - Kawasaki, JP

International Classification:

C07H 1/02
C07H 21/02

Abstract:

The present disclosure describes a convergent liquid phase process for manufacturing oligonucleotides by coupling two or more oligonucleotide fragments, each of which have two or more nucleotides. Also provided by the present disclosure are reaction steps involved the convergent liquid phase process.

US Patent:

20200109320, Apr 9, 2020

Filed:

Dec 5, 2019

Appl. No.:

16/704235

Inventors:

- Duesseldorf, DE
Hong JIANG - Irvine CA, US

International Classification:

C09J 123/26
C08L 23/26
C08L 23/22
C09J 123/22
C09J 5/00
B32B 25/18
B32B 17/06
B32B 25/08
B32B 37/12
H01L 51/52
H01L 51/44

Abstract:

The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for electronic devices that require low water vapor transmission rate.

US Patent:

20180350631, Dec 6, 2018

Filed:

Feb 20, 2018

Appl. No.:

15/899878

Inventors:

- Duesseldorf, DE
Hong Jiang - Irvine CA, US

International Classification:

H01L 21/56
C08L 63/00
C08K 5/09

Abstract:

This invention relates to thermosetting resin compositions useful for fluxing underfill applications, particularly in the form of a preapplied film.

US Patent:

20180226313, Aug 9, 2018

Filed:

Apr 5, 2018

Appl. No.:

15/945772

Inventors:

- Duesseldorf, DE
Hong Jiang - Irvine CA, US
Youko Murata - Yokohama, JP
Yusuke Horiguchi - Yokohama, JP
YounSang Kim - Foothill Ranch CA, US
Tadashi Takano - Yokohama-shi, JP

International Classification:

H01L 23/29
H01L 21/56
C08L 63/00
C08L 33/08
C08L 39/04

Abstract:

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Address:

21 Nottinghill Rd, Brighton, MA 02135

VIN:

WA1DKAFP4BA010379

Make:

AUDI

Model:

Q5

Year:

2011