A field programmable gate array (FPGA) cell useful in a FPGA array having column bitlines, read bitlines, and row wordlines is disclosed. The cell comprises a capacitor having a first terminal and a second terminal, the first terminal connected to a column bitline, said second terminal connected to a switch control node, the capacitor having a dielectric between the first and second terminal. The cell also includes a select transistor having a gate, a source, and a drain, the gate connected to the read bitline, the source connected to the switch control node, and the drain connected to a row wordline. Finally, the cell includes a switch being controlled by the switch control node.
Semiconductor Memory Cell And Memory Array Using A Breakdown Phenomena In An Ultra-Thin Dielectric
A semiconductor memory cell having a data storage element constructed around an ultra-thin dielectric, such as a gate oxide, is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. The memory cell is read by sensing the current drawn by the cell. A suitable ultra-thin dielectric is high quality gate oxide of about 50 thickness or less, as commonly available from presently available advanced CMOS logic processes.
Programming Methods And Circuits For Semiconductor Memory Cell And Memory Array Using A Breakdown Phenomena In An Ultra-Thin Dielectric
David Fong - Cupertino CA Fei Ye - Cupertino CA Jack Zezhong Peng - San Jose CA
Assignee:
Kilopass Technologies, Inc. - Sunnyvale CA
International Classification:
G11C 1604
US Classification:
35618908, 36518909, 36518911
Abstract:
A programming circuit includes a wordline decoder, an adjustable voltage generator, and a column transistor. The programming circuit is useful in programming a memory cell comprised of a select transistor and a data storage element. The data storage element is programmed by a programming current. The amount of the programming current can be modulated by the column transistor, the select transistor, or the adjustable voltage generator.
Reprogrammable Non-Volatile Memory Using A Breakdown Phenomena In An Ultra-Thin Dielectric
A reprogrammable non-volatile memory array and constituent memory cells is disclosed. The semiconductor memory cells each have a data storage element constructed around an ultra-thin dielectric, such as a gate oxide. The gate oxide is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. The memory cell is read by sensing the current drawn by the cell. A suitable ultra-thin dielectric is high quality gate oxide of about 50 thickness or less, as commonly available from presently available advanced CMOS logic processes. The memory cells are first programmed by stressing the gate oxide until soft breakdown occurs. The memory cells are then subsequently reprogrammed by increasing the breakdown of the gate oxide.
Smart Card Having Memory Using A Breakdown Phenomena In An Ultra-Thin Dielectric
A smart card having improved non-volatile memory and a processor. The memory includes of a plurality of memory cells. The semiconductor memory cells each have a data storage element constructed around an ultra-thin dielectric, such as gate oxide. The gate oxide is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. The memory cell is read be sensing the current drawn by the cell. A suitable ultra-thin dielectric is high quality gate oxide of about 50 angstroms thickness or less, as commonly available from presently available advance CMOS logic process.
High Density Semiconductor Memory Cell And Memory Array Using A Single Transistor
Jack Zezhong Peng - San Jose CA David Fong - Cupertino CA
Assignee:
Kilopass Technologies, Inc. - Sunnyvale CA
International Classification:
H01L 2994
US Classification:
257368, 257390, 257E2708, 257 5, 365177, 365178
Abstract:
A programmable memory cell comprised of a transistor located at the crosspoint of a column bitline and a row wordline is disclosed. The transistor has its gate formed from the column bitline and its source connected to the row wordline. The memory cell is programmed by applying a voltage potential between the column bitline and the row wordline to produce a programmed n+ region in the substrate underlying the gate of the transistor.
Method Of Testing The Thin Oxide Of A Semiconductor Memory Cell That Uses Breakdown Voltage
Jack Zezhong Peng - San Jose CA Harry Shengwen Luan - Saratoga CA Jianguo Wang - Cupertino CA Zhongshan Liu - Plano TX David Fong - Cupertino CA Fei Ye - Cupertino CA
Assignee:
Kilopass Technologies, Inc. - Sunnyvale CA
International Classification:
G11C 700
US Classification:
365201, 365149
Abstract:
A method of testing a memory cell is disclosed. The memory cell has a data storage element constructed around an ultra-thin dielectric, such as a gate oxide, which is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. In order to ensure that the gate oxide underlying the data storage elements are of sufficient quality for programming, the memory cells of a memory array may be tested by applying a voltage across the gate oxide of the data storage element and measuring the current flow. Resultant current flow outside of a predetermined range indicates a defective memory cell.
Semiconductor Memory Cell And Memory Array Using A Breakdown Phenomena In An Ultra-Thin Dielectric
A semiconductor memory cell having a data storage element constructed around an ultra-thin dielectric, such as a gate oxide, is used to store information by stressing the ultra-thin dielectric into breakdown (soft or hard breakdown) to set the leakage current level of the memory cell. The memory cell is read by sensing the current drawn by the cell. A suitable ultra-thin dielectric is high quality gate oxide of about 50 thickness or less, as commonly available from presently available advanced CMOS logic processes.
Name / Title
Company / Classification
Phones & Addresses
Mr Jack Peng Owner
La Vie Furniture Furniture - Retail
69 - 2700 Dufferin Street, York, ON M6B 4J3 (416)2562775
Mr Jack Peng Owner
La Vie Furniture Furniture - Retail
1181 Kennedy Road, Unit 5, Scarborough, ON M1P 2L2 (416)7570808
Mr Jack Peng Owner
La Vie Furniture Furniture - Retail
8 - 1515 Britannia Road East, York, ON L4W 4K1 (416)2562775
Jack Peng Founder And Chairman Of The Board
Kilopass Technology, Inc. Semiconductors · Semicondutor Design · Services-Misc Whol Electrical Equipment · Computer Sales · Electrical Apparatus and Equipment, Wiring Supplies, and Rel
3333 Octavius Dr SUITE 101, Santa Clara, CA 95054 (408)9808808
Jack Peng President
KILOPASS CORPORATION USA
1539 Eddington Pl, San Jose, CA 95129 (408)8138605