Skills:
Techniques and Equipment: Wafer aligning (EVG 620) and wafer bonding (EVG 510), transfer printing, film casting (CEE200X, Headway, Laurell), lithography (Nanonex 2600, MA4, ELS-7500EX), PECVD (PlasmaLab 100), ALD (Savannah 200), PVD (PVD75), RIE (PlasmaLab 80+), DRIE, plasma etch (Planar Etch II), ICP etch (Phantom III), wet etch (HF, Nanostrip), ellipsometry (AutoEL IV-NIR3), profilometry (KLA Tencor P7), interferometry (Zygo New View 7300), ultra-sonicating (Branson 5510), spin-rinse-drying (Superclean []