Jian Wen

age ~57

from Pleasanton, CA

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Also known as:

Connected to:

Jian Wen Phones & Addresses

License #:

18362 - Expired

Issued Date:

Nov 24, 2015

Renew Date:

Nov 24, 2015

Expiration Date:

Dec 31, 2016

Type:

Massage Therapist

Lead Frame Having A Flag With In-Plane And Out-Of-Plane Mold Locking Features
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US Patent:

20130049181, Feb 28, 2013
Filed:

Aug 30, 2011
Appl. No.:

13/220898
Inventors:

Jian Wen - Chandler AZ, US
Darrel R. Frear - Phoenix AZ, US
William G. McDonald - Payson AZ, US
International Classification:

H01L 23/495
H01L 21/56
US Classification:

257676, 438123, 257E23052, 257E21502, 257E21499
Abstract:

A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.

Techniques For Data Assignment From An External Distributed File System To A Database Management System
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US Patent:

20130173666, Jul 4, 2013
Filed:

Dec 29, 2011
Appl. No.:

13/340335
Inventors:

Yan Qi - Fremont CA, US
Yu Xu - Burlingame CA, US
Olli Pekka Kostamaa - Santa Monica CA, US
Jian Wen - Irvine CA, US
International Classification:

G06F 17/30
US Classification:

707798, 707E17011, 707E1701
Abstract:

Techniques for data assignment from an external distributed file system (DFS) to a database management system (DBMS) are provided. Data blocks from the DFS are represented as first nodes and access module processors of the DBMS are represented as second nodes. A graph is produced with the first and second nodes. Assignments are made for the first nodes to the second nodes based on evaluation of the graph to integrate the DFS with the DBMS.

Capacitive Pressure Sensor In An Overmolded Package
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US Patent:

20140033814, Feb 6, 2014
Filed:

Jul 31, 2012
Appl. No.:

13/562853
Inventors:

Jian Wen - Chandler AZ, US
William G. McDonald - Payson AZ, US
International Classification:

H01L 29/84
B60C 23/04
H01L 21/50
US Classification:

731465, 257419, 438 51, 257E29324, 257E21499
Abstract:

An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.

Lead Frame For Semiconductor Package With Enhanced Stress Relief
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US Patent:

20140264793, Sep 18, 2014
Filed:

Mar 12, 2013
Appl. No.:

13/794841
Inventors:

Kai Yun Yow - Petaling Jaya, MY
Alexander M. Arayata - Gilbert AZ, US
Jian Wen - Chandler AZ, US
International Classification:

H01L 23/495
US Classification:

257667, 257675
Abstract:

A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.