James Fiorenza - Wilmington MA, US Anthony Lochtefeld - Ipswich MA, US Jie Bai - Bedford MA, US Ji-Soo Park - Methuen MA, US Jennifer Hydrick - Kingston NH, US Jizhong Li - Bordentown NJ, US Zhiyuan Cheng - Lincoln MA, US
Methods and structures are provided for formation of devices, e. g. , solar cells, on substrates including, e. g. , lattice-mismatched materials, by the use of aspect ratio trapping (ART) and epitaxial layer overgrowth (ELO). In general, in a first aspect, embodiments of the invention may include a method of forming a structure. The method includes forming a first opening in a masking layer disposed over a substrate that includes a first semiconductor material. A first layer, which includes a second semi-conductor material lattice-mismatched to the first semiconductor material, is formed within the first opening. The first layer has a thickness sufficient to extend above a top surface of the masking layer. A second layer, which includes the second semiconductor material, is formed on the first layer and over at least a portion of the masking layer. A vertical growth rate of the first layer is greater than a lateral growth rate of the first layer and a lateral growth rate of the second layer is greater than a vertical growth rate of the second layer.
Formation Of Devices By Epitaxial Layer Overgrowth
Zhiyuan Cheng - Lincoln MA, US James Fiorenza - Wilmington MA, US Jennifer M. Hydrick - Kingston NH, US Anthony J. Lochtefeld - Ipswich MA, US Ji-Soo Park - Methuen MA, US Jie Bai - Bedford MA, US Jizhong Li - Bordentown NJ, US
Methods and structures are provided for formation of devices on substrates including, e. g. , lattice-mismatched materials, by the use of aspect ratio trapping and epitaxial layer overgrowth. A method includes forming an opening in a masking layer disposed over a substrate that includes a first semiconductor material. A first layer, which includes a second semiconductor material lattice-mismatched to the first semiconductor material, is formed within the opening. The first layer has a thickness sufficient to extend above a top surface of the masking layer. A second layer, which includes the second semiconductor material, is formed on the first layer and over at least a portion of the masking layer. A vertical growth rate of the first layer is greater than a lateral growth rate of the first layer and a lateral growth rate of the second layer is greater than a vertical growth rate of the second layer.
Voya Financial Windsor, CT May 2014 to Aug 2014 Actuarial InternChina Life Reinsurance Company
May 2013 to Jul 2013 Actuarial InternHuatai P&C Insurance Company
Nov 2012 to Dec 2012 Actuarial InternAbility Resources Inc Worcester, MA Aug 2009 to May 2010 Senior Year Major Project
Education:
Illinois State University Normal, IL 2013 to 2014 Master of Science in Actuarial ScienceWorcester Polytechnic Institute Worcester, MA 2007 to 2010 Bachelor of Science in Actuarial Mathematics
Nov 2012 to Dec 2012 Actuarial InternshipEIC Group
Jul 2011 to Oct 2012 TOEFL TeacherAbility Resources Inc
Aug 2009 to May 2010 Senior Major Qualifying Project (MQP)Huatai Property and Casualty Insurance Company
Jun 2008 to Aug 2008 Actuarial Internship
Education:
Illinois State University Normal, IL 2013 to 2014 Master in Actuarial Science SequenceWorcester Polytechnic Institute Worcester, MA May 2010 Bachelor of Science in Mathematics