Jill M Hruby

age ~66

from Albuquerque, NM

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Also known as:

Jill Hruby Hruby
Jill Hruby Rvt Hruby
Jill Te Hruby
Jill Marie Sweeney
Jill Marie Griffiths
Donald Sweeney

Phone and address:: 348 Whiteoaks Dr NE, Albuquerque, NM 87122
(505)5542120

Connected to:

Jill Hruby Phones & Addresses

348 Whiteoaks Dr NE, Albuquerque, NM 87122 • (505)5542120
San Francisco, CA
2233 Saint Charles Ct, Livermore, CA 94550 • (925)2921247 • (925)4551247
1456 Milan Ct, Livermore, CA 94550 • (925)4551247
Alamo, CA
Meridian, ID
Saint George, SC
Alameda, CA

Work

Company:

Various
Dec 2019
Position:

Independent consultant

Education

Degree:

Master of Science, Masters
School / High School:

University of California, Berkeley
1981 to 1983
Specialities:

Mechanical Engineering

Skills

Program Management • Homeland Security • National Security • Nuclear • Systems Engineering • R&D • Defense • Simulations • Engineering Management • Government • Security Clearance • Engineering • Physics • Nuclear Proliferation • Sensors • Materials Science • Proposal Writing • Dod • Security • Earned Value Management • Nuclear Safety • Analysis • Military • Information Assurance • Federal Government • Intelligence Analysis • Nuclear Engineering • Aerospace • Science • Operational Planning • High Performance Computing • Nanotechnology • Counterterrorism • Energy • Optics • Intelligence • Air Force • Command • Radiation • Materials • Risk Assessment • Emergency Management • Fortran • Vulnerability Assessment • Navy • Reactor • Technical Writing • Numerical Analysis • Mathematical Modeling • Characterization

Industries

Research

Resumes

Independent Consultant

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Location:

Albuquerque, NM

Industry:

Research

Work:

Various
Independent Consultant
Nuclear Threat Initiative
Sam Nunn Distinguished Fellow
Sandia National Laboratories Jul 2015 - May 2017
President and Laboratories Director
Sandia National Laboratories Apr 2010 - Jul 2015
Vice President
Sandia National Laboratories Mar 2005 - Apr 2010
Director, Homeland Security Programs

Education:

University of California, Berkeley 1981 - 1983
Master of Science, Masters, Mechanical Engineering Purdue University 1977 - 1981
Bachelors, Bachelor of Science, Mechanical Engineering

Skills:

Program Management
Homeland Security
National Security
Nuclear
Systems Engineering
R&D
Defense
Simulations
Engineering Management
Government
Security Clearance
Engineering
Physics
Nuclear Proliferation
Sensors
Materials Science
Proposal Writing
Dod
Security
Earned Value Management
Nuclear Safety
Analysis
Military
Information Assurance
Federal Government
Intelligence Analysis
Nuclear Engineering
Aerospace
Science
Operational Planning
High Performance Computing
Nanotechnology
Counterterrorism
Energy
Optics
Intelligence
Air Force
Command
Radiation
Materials
Risk Assessment
Emergency Management
Fortran
Vulnerability Assessment
Navy
Reactor
Technical Writing
Numerical Analysis
Mathematical Modeling
Characterization

Name / Title

Company / Classification

Phones & Addresses

Jill Hruby
Chairman of the Board

CENTER FOR INTERNATIONAL STUDIES
Civic/Social Association · Nonclassifiable Establishments

PO Box 92995, Albuquerque, NM 87199
PO Box 92995, Albuquerque, NM 87199

Us Patents

Sacrificial Plastic Mold With Electroplatable Base
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US Patent:

6422528, Jul 23, 2002
Filed:

Jan 17, 2001
Appl. No.:

09/765078
Inventors:

Linda A. Domeier - Danville CA
Jill M. Hruby - Livermore CA
Alfredo M. Morales - Livermore CA
Assignee:

Sandia National Laboratories - Livermore CA
International Classification:

B22D 2504
US Classification:

249 60, 249 61, 249135, 249 83
Abstract:

A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Sacrificial Plastic Mold With Electroplatable Base
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US Patent:

6929733, Aug 16, 2005
Filed:

Apr 24, 2002
Appl. No.:

10/134060
Inventors:

Linda A. Domeier - Danville CA, US
Jill M. Hruby - Livermore CA, US
Alfredo M. Morales - Livermore CA, US
Assignee:

Sandia Corporation - Livermore CA
International Classification:

C25D001/00
C25D001/08
C25D001/10
B29B007/00
B29C043/00
US Classification:

205 67, 205 70, 205 75, 264219, 264221, 264222, 264226, 264322, 264325, 2643281
Abstract:

A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.

Porous Electrode Apparatus For Electrodeposition Of Detailed Metal Structures Or Microelectronic Interconnections
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US Patent:

6355147, Mar 12, 2002
Filed:

Dec 10, 1999
Appl. No.:

09/459008
Inventors:

Stewart K. Griffiths - Danville CA
Robert H. Nilson - Cardiff CA
Jill M. Hruby - Livermore CA
Assignee:

Sandia Corporation - Livermore CA
International Classification:

C25B 900
US Classification:

204242, 204DIG 7, 204284
Abstract:

An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.