A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.
Research Scientist, Lab ManagerOregon State University
2009 to 2014 Graduate Research AssistantAnhui Medical University
2007 to 2009 Research Assistant
Education:
Oregon State University Corvallis, OR 2009 to 2014 Doctor of Philosophy in Biochemistry & BiophysicsAnhui Medical University Hefei, CN 2004 to 2009 Bachelor of Medicine in pathogenic microbiology, immunology
Skills:
enzyme assay, western blot, PCR, RT-PCR, protein expression and characterization, dose-response analyses, ELISA, fluorescence microscopy, confocal microscopy, cell culture, transformation, mutant screening, recombinant DNA techniques, cloning, gene knockout and overexpression, DNA sequencing