Kevin M Weaver

US Patent:

7848562, Dec 7, 2010

Filed:

Sep 26, 2005

Appl. No.:

11/235794

Inventors:

Steven Jacobson - Dublin CA, US
Duc Huu Nguyen - San Jose CA, US
William Ng - San Jose CA, US
Zachary Joshua Gemmill - Mountain View CA, US
Usharani Bhimavarapu - San Jose CA, US
Kevin Weaver - San Jose CA, US

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G06K 9/00

US Classification:

382145

Abstract:

The time required to perform a passive voltage contrast test of an area of interest of a layer of interest is substantially reduced by digitizing a passive voltage contrast image to form contrast data that represents the image, and comparing the contrast data to computer aided design (CAD) data that defines the semiconductor device.

US Patent:

60838485, Jul 4, 2000

Filed:

Mar 31, 1998

Appl. No.:

9/052884

Inventors:

Emery Sugasawara - Pleasanton CA
Kevin Weaver - San Jose CA
Jay Hidy - Saratoga CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 2100
B08B 300
B08B 304
C23F 100

US Classification:

438745

Abstract:

A method for removing solder from the leads of ICs including immersing the IC in an acid solution. The acid solution dissolves the excess solder on the IC leads. The acid solution is preferably a hydrogen chloride solution containing about 38% hydrogen chloride and 62% water. The acid solution, however, can contain up to 50% hydrogen chloride. After the IC is immersed for a period of time, preferably ten minutes, it is removed from the acid solution and rinsed with water. The IC is rinsed so as to remove any remaining acid solution residue. Rinsing for 5 minutes or more typically ensures removing all of the acid solution. The IC is then inspected to determine whether substantially all of the excess solder is removed from the IC leads. If excess solder still remains on the IC leads, the IC is reintroduced into the solder removing process including immersing the IC in the acid solution, rinsing the IC with water, and inspecting the IC. The process is repeated until substantially all, if not all, of the excess solder is removed.