Lei Jiang

US Patent:

20040159923, Aug 19, 2004

Filed:

Feb 15, 2003

Appl. No.:

10/367266

Inventors:

Sergei Skokov - San Jose CA, US
Lei Jiang - Aloha OR, US
Sadasivan Shankar - Cupertino CA, US

International Classification:

H01L023/02

US Classification:

257/678000

Abstract:

A cyclotene chemical structure may be modified to reduce its curing temperature. With the reduced curing temperature, the material may be highly advantageous as an underfill material for surface nonpackaging.

US Patent:

20050054143, Mar 10, 2005

Filed:

Sep 10, 2004

Appl. No.:

10/939226

Inventors:

Sergei Skokov - San Jose CA, US
Lei Jiang - Aloha OR, US
Sadasivan Shankar - Cupertino CA, US

International Classification:

H01L021/44
H01L021/48
H01L021/50
H01L023/02

US Classification:

438123000

Abstract:

A cyclotene chemical structure may be modified to reduce its curing temperature. With the reduced curing temperature, the material may be highly advantageous as an underfill material for surface nonpackaging.

US Patent:

20060138087, Jun 29, 2006

Filed:

Dec 29, 2004

Appl. No.:

11/026322

Inventors:

Harsono Simka - Saratoga CA, US
Sadasivan Shankar - Cupertino CA, US
Lei Jiang - Camas WA, US
Paul Fischer - Portland OR, US
Anne Miller - Portland OR, US
Kenneth Cadien - Portland OR, US

International Classification:

C09K 13/00
C03C 15/00
H01L 21/302
B44C 1/22

US Classification:

216088000, 438692000, 252079100, 216089000

Abstract:

A slurry for use in a chemical mechanical polishing process for planarizing copper-based metal structures on a substrate comprises an oxidizer, an organic complexing agent, surfactants, and a plurality of copper-based metal abrasive particles, wherein the copper in the copper-based metal is capable of dissolving into the slurry and forming copper ion complexes. During the chemical mechanical polishing process, the copper removal rate may be selectively increased by increasing the concentration of copper metal abrasive particles in the slurry, and the copper removal rate may be selectively decreased by decreasing the concentration of copper metal abrasive particles in the slurry.