Lei M Jiang

US Patent:

20040159923, Aug 19, 2004

Filed:

Feb 15, 2003

Appl. No.:

10/367266

Inventors:

Sergei Skokov - San Jose CA, US
Lei Jiang - Aloha OR, US
Sadasivan Shankar - Cupertino CA, US

International Classification:

H01L023/02

US Classification:

257/678000

Abstract:

A cyclotene chemical structure may be modified to reduce its curing temperature. With the reduced curing temperature, the material may be highly advantageous as an underfill material for surface nonpackaging.

US Patent:

20050054143, Mar 10, 2005

Filed:

Sep 10, 2004

Appl. No.:

10/939226

Inventors:

Sergei Skokov - San Jose CA, US
Lei Jiang - Aloha OR, US
Sadasivan Shankar - Cupertino CA, US

International Classification:

H01L021/44
H01L021/48
H01L021/50
H01L023/02

US Classification:

438123000

Abstract:

A cyclotene chemical structure may be modified to reduce its curing temperature. With the reduced curing temperature, the material may be highly advantageous as an underfill material for surface nonpackaging.

US Patent:

20060138087, Jun 29, 2006

Filed:

Dec 29, 2004

Appl. No.:

11/026322

Inventors:

Harsono Simka - Saratoga CA, US
Sadasivan Shankar - Cupertino CA, US
Lei Jiang - Camas WA, US
Paul Fischer - Portland OR, US
Anne Miller - Portland OR, US
Kenneth Cadien - Portland OR, US

International Classification:

C09K 13/00
C03C 15/00
H01L 21/302
B44C 1/22

US Classification:

216088000, 438692000, 252079100, 216089000

Abstract:

A slurry for use in a chemical mechanical polishing process for planarizing copper-based metal structures on a substrate comprises an oxidizer, an organic complexing agent, surfactants, and a plurality of copper-based metal abrasive particles, wherein the copper in the copper-based metal is capable of dissolving into the slurry and forming copper ion complexes. During the chemical mechanical polishing process, the copper removal rate may be selectively increased by increasing the concentration of copper metal abrasive particles in the slurry, and the copper removal rate may be selectively decreased by decreasing the concentration of copper metal abrasive particles in the slurry.

US Patent:

20100299669, Nov 25, 2010

Filed:

May 20, 2009

Appl. No.:

12/469013

Inventors:

Heather O'Cull - Seattle WA, US
Lei Jiang - Redmond WA, US

Assignee:

MICROSOFT CORPORATION - Redmond WA

International Classification:

G06F 9/46

US Classification:

718102

Abstract:

A computing system generates and displays a comparison task list that reports differences between a source task list for a project and a modified task list for the project. The comparison task list may enable a user to determine the implications of changes to the project by providing a comparison of the source task list and the modified task list. The computing system generates the comparison task list by generating the comparison task list as a copy of the source task list. The computing system automatically adds each task item in the modified task list that does not have an equivalent task item in the comparison task list to the comparison task list at positions that depend on whether the task items have previously-processed sibling task items in the modified task list. When the computing system has processed each task item in the modified task list, the computing system displays the comparison task list.