Lin Zhou

US Patent:

6839202, Jan 4, 2005

Filed:

Apr 26, 2002

Appl. No.:

10/133596

Inventors:

Lin Zhou - Fishkill NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 548

US Classification:

3602345, 174 36

Abstract:

An assembly includes a suspension, a magnetic head assembly, first and second write wires and first and second read wires wherein the magnetic head assembly includes a write head and a read head with the first and second write wires connected to the write head and the first and second read wires connected to the read head and wherein the first and second insulative sheaths are disposed about the first and second read wires and first and second conductive sheaths are disposed about the first and second insulative sheaths. In another aspect of the invention, third and fourth insulative sheaths are disposed about the first and second write wires and third and fourth conductive sheaths are disposed about the third and fourth insulative sheaths.

US Patent:

7065425, Jun 20, 2006

Filed:

Jun 22, 2005

Appl. No.:

11/160404

Inventors:

Sarah A. Kay - Jefferson City TN, US
Eric P. Solecky - Hyde Park NY, US
Lin Zhou - LaGrangeville NY, US

Assignee:

Internaitonal Business Machines Corporation - Armonk NY

International Classification:

G06F 19/00

US Classification:

700110, 700121, 702183

Abstract:

A method of identifying failures in a metrology tool system used to measure desired dimensions in microelectronic features. Each metrology tool in the system runs a plurality of recipes for measuring desired dimensions in microelectronic features, with each recipe comprising a set of instructions for measuring at least one dimension in a microelectronic feature. The system includes an error log having stored thereon failures in measurement of microelectronic feature dimensions. The method includes determining normalized number of errors for the recipes used by the metrology tool from the failures stored in the error log, identifying one or more recipes having the greatest normalized number of errors in the error log, identifying, in a list of jobs to be performed by the metrology tool, the one or more identified recipes having the greatest normalized number of errors, and from the identified one or more recipes having the greatest normalized number of errors, determining the cause of the errors in the one or more recipes. The method then includes effecting a change in the one or more identified recipes having the greatest normalized number of errors to correct the errors therein and tracking a metrology tool job having the one or more recipes in which a change has been effected to determine whether the cause of errors has been corrected.

US Patent:

7187993, Mar 6, 2007

Filed:

Apr 19, 2006

Appl. No.:

11/407543

Inventors:

Sarah A. Kay - Jefferson City TN, US
Eric P. Solecky - Hyde Park NY, US
Lin Zhou - LaGrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 19/00

US Classification:

700110, 700121, 702183

Abstract:

A method of identifying failures in a metrology tool system used to measure desired dimensions in microelectronic features. Each metrology tool in the system runs a plurality of recipes for measuring desired dimensions in microelectronic features, with each recipe comprising a set of instructions for measuring at least one dimension in a microelectronic feature. The system includes an error log having stored thereon failures in measurement of microelectronic feature dimensions. The method includes determining normalized number of errors for the recipes used by the metrology tool from the failures stored in the error log, identifying one or more recipes having the greatest normalized number of errors in the error log, identifying, in a list of jobs to be performed by the metrology tool, the one or more identified recipes having the greatest normalized number of errors, and from the identified one or more recipes having the greatest normalized number of errors, determining the cause of the errors in the one or more recipes. The method then includes effecting a change in the one or more identified recipes having the greatest normalized number of errors to correct the errors therein and tracking a metrology tool job having the one or more recipes in which a change has been effected to determine whether the cause of errors has been corrected.

US Patent:

7305320, Dec 4, 2007

Filed:

Feb 15, 2006

Appl. No.:

11/307640

Inventors:

Ejaj Ahmed - Chicago IL, US
Charles N. Archie - Granite Springs NY, US
Stephen W. Goodrich - South Burlington VT, US
Eric P. Solecky - Hyde Park NY, US
Georgios A. Vakas - Poughkeepsie NY, US
Erwin E. Weissmann - Southbury CT, US
Lin Zhou - LaGrangeville NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01B 7/00
G01R 31/26

US Classification:

702155, 438 14

Abstract:

A method of preparing recipes for operating a metrology tool, each recipe including a set of instructions for measuring dimensions in a microelectronic feature. A database includes a plurality of known instructions with best known methods for measuring different feature dimensions by creating a summary of a recipes used by the tool, and adding categorization attributes to identify the summary for retrieval from the database. There is provided a desired recipe having instructions for measuring desired dimensions, including a summary of parameters relating to tool function for the feature dimension to be measured. The method includes comparing the instructions in the desired recipe with the instructions in the database, identifying differences therebetween, modifying the desired recipe instructions to conform to the database instructions, verifying the desired recipe prior to using the modified desired recipe by the tool, and using the desired recipe to execute a feature measurement on the tool.

US Patent:

7325294, Feb 5, 2008

Filed:

Nov 17, 2004

Appl. No.:

10/991900

Inventors:

Lin Zhou - Fishkill NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 5/187

US Classification:

2960303, 2960304, 29846, 29868, 205128, 205135, 20419234, 20419217, 174350

Abstract:

A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then, forming electrically conductive wire material into openings in a first forming layer to form first and second read wires and first and second write wires. Forming a top insulation layer on the bottom insulation layer and on the wires. Then, forming a second forming layer on the top insulation layer with first, second, third, fourth and fifth openings down to the top insulation layer. Ion milling portions of the top insulation layer exposed by the openings in the second forming layer down to the bottom shield layer, then removing the second forming layer. Then, forming nonmagnetic electrically conductive middle shield layers in the openings in electrical contact with the bottom shield layer and forming a top shield layer on top of the middle shield layer.

US Patent:

7369947, May 6, 2008

Filed:

Jun 13, 2006

Appl. No.:

11/423844

Inventors:

Lin Zhou - LaGrangeville NY, US
Eric P. Solecky - Hyde Park NY, US

Assignee:

International Business Machines, Corporation - Armonk NY

International Classification:

G06F 17/00

US Classification:

702 27, 702170, 438 14, 438514, 734321

Abstract:

A test method for measuring adsorbed molecular contamination uses a test structure that includes a substrate comprising a plurality of separated test sites having a plurality separate thicknesses having a base design thickness and a designed thickness interrelationship. The test structure is exposed to a molecular contaminant environment to provide an adsorbed molecular contaminant layer upon each of the plurality of separated test sites. The plurality of separated test sites with the adsorbed molecular contaminant layer thereon is measured. An appropriate algorithm that considers the designed thickness interrelationship is used to determine at least one of: (1) the base design thickness; and (2) a thickness of the adsorbed molecular contaminant layer.

US Patent:

7397252, Jul 8, 2008

Filed:

Jul 31, 2006

Appl. No.:

11/461068

Inventors:

Lin Zhou - LaGrangeville NY, US
Eric P. Solecky - Hyde Park NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 27/00
F41G 1/38
G01N 23/00
G01J 5/00
G01B 11/28
G01B 11/06
G01B 11/02

US Classification:

324600, 33297, 250306, 250526, 356628, 356634, 356635

Abstract:

A method for accurately measuring feature sizes and quantifying the beam spot size in a CDSEM at real time is provided. The inventive method is based on a scanning microscope and it works on both conductive and non-conductive features. The measurement of conductive feature includes first providing a conductive feature on a surface of a substrate (the substrate maybe an insulator, a semiconductor or a material stack thereof). The conductive feature is then connected to ground and thereafter an electron beam probe raster scans the sample. When the electron beam probe hits the conductive feature the spot will have a negative potential. The potential difference between the spot and the ground will induce an electrical current flow. When the electrical beam is off the conductive feature, there will be no current flow. Therefore, by measuring the current response to the location of the beam spot, the dimension of the conductive feature can be derived.

US Patent:

7477365, Jan 13, 2009

Filed:

Jul 26, 2007

Appl. No.:

11/828666

Inventors:

Shahin Zangooie - Hopewell Junction NY, US
Roger M. Young - Warwick NY, US
Lin Zhou - LaGrangeville NY, US
Clemente Bottini - Marlboro NY, US
Ronald D. Fiege - Hopewell Junction NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01J 1/00
G01B 11/26
G01B 11/24
G01B 11/30
G01C 1/00

US Classification:

356121, 356138, 356601

Abstract:

A method, system and computer program product for determining a geometric parameter of an optical spot of a light beam are disclosed. A method comprises: providing a calibration target, the calibration target including a systematic variation in a parameter; measuring the calibration target with respect to the systematic variation using the light beam to obtain a plurality of measurements; and analyzing the measurements and the systematic variation to determine the geometric parameter of the optical spot.