Lin Chi C Zhou

US Patent:

7532867, May 12, 2009

Filed:

Mar 15, 2006

Appl. No.:

11/377695

Inventors:

Shih Mo - Milpitas CA, US
Junjie Yang - Santa Clara CA, US
Lin Zhou - Milpitas CA, US
Chung-Hsing Chang - Milpitas CA, US
Ted Hsiung - Saratoga CA, US

International Classification:

H04B 1/44
H04Q 7/20

US Classification:

455 78, 4551274, 4555521

Abstract:

Transceiver architectures for supporting multi-band radio frequencies are disclosed. According to one aspect of the present invention, a number of processing channels are designed, each for one specified carrier frequency. A number of switching means is provided to ensure that a processing channel is properly selected for a specified carrier frequency. Each of the processing channels includes at least an amplified and a low-pass filter, where the low-pass filter is automatically programmable in response to a wireless standard (e. g. , Wi-Fi or WiMAX). A single voltage oscillator (VCO) is used to support operations of each of the processing channels.

US Patent:

7592817, Sep 22, 2009

Filed:

Jul 17, 2007

Appl. No.:

11/778679

Inventors:

Robert J. Foster - Brooklyn NY, US
Lin Zhou - LaGrangeville NY, US
Shahin Zangooie - Hopewell Junction NY, US
Roger M. Young - Warwick NY, US
Clemente Bottini - Marlboro NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/08
G01R 31/02
G01R 31/26

US Classification:

324525, 324758, 324765

Abstract:

A system and method for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool comprising at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact. The method comprises measuring current on each branch of a circuit and calculating an angle of a wafer based on a difference in the current on each branch of the circuit.

US Patent:

8451008, May 28, 2013

Filed:

Jul 8, 2009

Appl. No.:

12/499419

Inventors:

Robert J. Foster - Brooklyn NY, US
Lin Zhou - LaGrangeville NY, US
Roger M. Young - Warwick NY, US
Clemente Bottini - Marlboro NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 31/08

US Classification:

324522, 324525

Abstract:

A system and method is provided for correcting alignment of a product on a tool and, more particularly, to a system and method for correcting alignment of a wafer on a chuck of a tool. The system is a tool that includes at least one contact near a circumference of the tool and a grounded contact proximate to the at least one contact.

US Patent:

60105380, Jan 4, 2000

Filed:

Jan 11, 1996

Appl. No.:

8/585164

Inventors:

Mei H. Sun - Los Altos CA
Herbert E. Litvak - Cupertino CA
Huey M. Tzeng - San Jose CA
Daniel E. Glenn - Mountain View CA
Earl M. Jensen - Sunnyvale CA
Frank J. Hausman - San Francisco CA
Lin Jun Zhou - Palo Alto CA

Assignee:

Luxtron Corporation - Santa Clara CA

International Classification:

H05K 304
B24B 704

US Classification:

756345

Abstract:

In an apparatus for removing material from an article, such as an exposed surface of an intermediate integrated circuit structure, by planarizing, polishing, etching or the like, a sensor is mechanically coupled to a moving carrier of the article for directing through the article to its first side an electromagnetic radiation beam having a wavelength band to which the structure is substantially transparent. The beam is detected after interacting with the article, such as being reflected from its exposed surface, and resulting information of the state of the processing of the exposed surface is transmitted from the moving carrier to a stationary receiver by radiation without the use of any physical transmission media such as wires or optical fibers. Multiple sensors mounted on the moving article carrier provide information of the uniformity of the processing across the exposed article surface. The radiation signal received by the stationary receiver is used to monitor or control the processing, such as by determining an endpoint thereof.

US Patent:

20230038873, Feb 9, 2023

Filed:

Aug 19, 2022

Appl. No.:

17/892006

Inventors:

- Hoboken NJ, US
Lin Zhou - Weehawken NJ, US

International Classification:

B01D 53/70
B01D 53/18
B01D 53/78

Abstract:

Process and apparatus () are disclosed for capturing and converting an ozone-depleting alkyl halide fumigant from a fumigant/air mixed stream () by absorbing it into a metal hydroxide-alcohol buffer solution () in an absorber/scrubber () to produce a fumigant-free air stream (). The captured alkyl halide in aqueous alcohol solution can actively react with the metal hydroxide in alcohol solution to produce a value-added product, such as a precipitate metal halide, and another alcohol that further enhances absorption. The absorbing solution is well-mixed with make-up alcohol and alkali streams to maintain the concentration of the metal hydroxide in the desired buffer solution range. The solid precipitate metal halide () is separated from the liquid stream, and the metal hydroxide-containing mixed alcohol stream () is recycled to the absorber/scrubber ().

US Patent:

20230032737, Feb 2, 2023

Filed:

Jul 26, 2022

Appl. No.:

17/814980

Inventors:

- Philadelphia PA, US
Lin Zhou - Bryn Mawr PA, US
Sayaka Sato - Philadelphia PA, US
Takashi Miwa - Bala Cynwyd PA, US
Damodar Gullipalli - Philadelphia PA, US
Madhu Golla - Philadelphia PA, US

International Classification:

C07K 16/18
A61P 37/06
A01K 67/027

Abstract:

This invention relates to selective inhibition of the alternative pathway (AP) of the complement system using an anti-factor D antibody. Specifically, the invention relates to methods of treating an AP-mediated disease or AP-mediated disorder in an individual by contacting the individual with an anti-factor D antibody.

US Patent:

20200357639, Nov 12, 2020

Filed:

Jul 30, 2020

Appl. No.:

16/944051

Inventors:

- Santa Clara CA, US
Steven R. Sherman - Newton MA, US
Nadine Alexis - Santa Clara CA, US
Lin Zhou - San Jose CA, US

Assignee:

APPLIED Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/033
H01L 21/311

Abstract:

Disclosed are methods for reducing transfer pattern defects in a semiconductor device. In some embodiments, a method includes providing a semiconductor device including a plurality of photoresist lines on a stack of layers, wherein the plurality of photoresist lines includes a bridge defect extending between two or more photoresist lines of the plurality of photoresist lines. The method may further include forming a plurality of mask lines by etching a set of trenches in a first layer of the stack of layers, and removing the bridge defect by etching the bridge defect at a non-zero angle of inclination with respect to a perpendicular to a plane of an upper surface of the stack of layers.

US Patent:

20200294802, Sep 17, 2020

Filed:

Jun 21, 2019

Appl. No.:

16/448374

Inventors:

- Santa Clara CA, US
Steven R. Sherman - Newton MA, US
Nadine Alexis - Santa Clara CA, US
Lin Zhou - San Jose CA, US

Assignee:

APPLIED Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/033
H01L 21/311

Abstract:

Disclosed are methods for reducing transfer pattern defects in a semiconductor device. In some embodiments, a method includes providing a semiconductor device including a plurality of photoresist lines on a stack of layers, wherein the plurality of photoresist lines includes a bridge defect extending between two or more photoresist lines of the plurality of photoresist lines. The method may further include forming a plurality of mask lines by etching a set of trenches in a first layer of the stack of layers, and removing the bridge defect by etching the bridge defect at a non-zero angle of inclination with respect to a perpendicular to a plane of an upper surface of the stack of layers.