Mei Ling Wen

US Patent:

20040200725, Oct 14, 2004

Filed:

Apr 9, 2003

Appl. No.:

10/410105

Inventors:

Joseph Yahalom - Emeryville CA, US
Mei Wen - King of Prussia PA, US
Roman Mostovoy - San Francisco CA, US

Assignee:

Applied Materials Inc.

International Classification:

C25D021/06
C25D021/16

US Classification:

205/098000

Abstract:

Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.