Michael L Davenport

US Patent:

20220360336, Nov 10, 2022

Filed:

Jul 16, 2022

Appl. No.:

17/866482

Inventors:

- Santa Clara CA, US
Roy Edward Meade - Lafayette CA, US
Mark Wade - Oakland CA, US
Alexandra Wright - San Francisco CA, US
Vladimir Stojanovic - Berkeley CA, US
Rajeev Ram - San Francisco CA, US
Milos Popovic - San Francisco CA, US
Derek Van Orden - San Francisco CA, US
Michael Davenport - San Francisco CA, US

International Classification:

H04B 10/50
H01S 5/40
H01S 5/026
H04B 10/80
H01S 5/02325

Abstract:

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

US Patent:

20200158959, May 21, 2020

Filed:

Nov 15, 2019

Appl. No.:

16/685838

Inventors:

- Emeryville CA, US
Michael Davenport - Emeryville CA, US
Roy Edward Meade - Lafayette CA, US

International Classification:

G02B 6/30
G02B 6/122
H01L 21/56

Abstract:

A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.