Michael M Horner

US Patent:

47792442, Oct 18, 1988

Filed:

May 2, 1983

Appl. No.:

6/490577

Inventors:

Michael S. Horner - Davis CA
Axel F. Brisken - Shingle Springs CA

Assignee:

General Electric Company - Milwaukee WI

International Classification:

H04R 1700

US Classification:

367140

Abstract:

An ultrasonic transducer assembly includes noise suppressing backing material for the transducer comprising a composite of a matrix material and particles of an attenuating soft material such as rubber, epoxy, and plastic. The particle size is preferably selected by sieving the particles through a sieve of grid size 30 to 80. In preferred embodiments the particles of attenuating soft material are filled with particles of heavy oxides, metal powders, or other density lowering fillers. The ratio of matrix material to filler particles determines mechanical strength and attenuation of the composite material. Attenuation coefficient and size of the filler particles determines the attenuation of the composite material.

US Patent:

45286523, Jul 9, 1985

Filed:

Dec 30, 1981

Appl. No.:

6/335635

Inventors:

Michael S. Horner - Davis CA
Axel F. Brisken - Shingle Springs CA
Claudio I. Zanelli - Fair Oaks CA

Assignee:

General Electric Company - Milwaukee WI

International Classification:

H04R 1700

US Classification:

367162

Abstract:

An improved material for an ultrasonic transducer assembly having improved noise suppression characteristics comprising an ultrasonic transducer having a plurality of surfaces, a housing for receiving said transducer whereby one surface of said transducer is free to transmit and receive ultrasonic waves, and a material positioned about said transducer and between said transducer and the environment or housing for attenuating ultrasonic energy, said material comprising a heavily loaded resin based on an unfilled low viscosity potting gel and a filler selected from the group consisting of heavy oxides, metal powders, and density lowering fillers. In specific embodiments lead oxide, tungsten powder, and glass microspheres have been used as the filler in a silicone or flexible epoxy.