Peng M Zhou

US Patent:

6722403, Apr 20, 2004

Filed:

Jan 24, 2002

Appl. No.:

10/057370

Inventors:

Peng Zhou - Newtown PA
Edward Joseph Kuspiel - Rahway NJ
Waldemar Ruediger - New Hope PA
Alexander Bertok - Edison NJ
Carl J. Trpisovsky - Kendall Park NJ

Assignee:

Bristol-Myers Squibb Company - Princeton NJ

International Classification:

F62B 1100

US Classification:

141129, 141 83, 141153, 141178, 141181, 141233, 222 52, 222 77, 222413

Abstract:

A bifurcated bracket carries two powder dispensing assemblies. Each assembly includes a powder reservoir and a rotatable screw received within a compliant silicone sleeve. The outer diameter of the screw is slightly larger than the inner diameter of the sleeve such that the screw blade maintains direct contact with the sleeve wall as the screw is rotated. The bracket is sequentially moved to align each assembly with containers in two arrays. Each array of containers is situated in a tray. The trays are manually positioned on independent scales which generate signals that are a function of the sensed weight of each array. To fill each container, the screw in the aligned assembly is rotated at a high rate for an initial period and then at a slower rate. The scales are operational only during the slower rate period. Assembly movement and screw rotation are computer controlled.

US Patent:

6986382, Jan 17, 2006

Filed:

May 16, 2003

Appl. No.:

10/439912

Inventors:

Girish Upadhya - San Jose CA, US
Thomas W. Kenny - San Carlos CA, US
Peng Zhou - Albany CA, US
Mark Munch - Los Altos CA, US
James Gill Shook - Santa Cruz CA, US
Kenneth Goodson - Belmont CA, US
David Corbin - Los Altos CA, US

Assignee:

Cooligy Inc. - Mountain View CA

International Classification:

F28F 7/00

US Classification:

165 804, 16510433, 16540421, 361700, 257715, 174 151

Abstract:

A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

US Patent:

6988534, Jan 24, 2006

Filed:

May 16, 2003

Appl. No.:

10/439635

Inventors:

Thomas W. Kenny - San Carlos CA, US
Mark Munch - Los Altos CA, US
Peng Zhou - Albany CA, US
James Gill Shook - Santa Cruz CA, US
Girish Upadhya - San Jose CA, US
Kenneth Goodson - Belmont CA, US
David Corbin - Los Altos CA, US

Assignee:

Cooligy, Inc. - Mountain View CA

International Classification:

F28F 7/00

US Classification:

165 804, 16510421, 16510433, 361700, 174 151, 257715

Abstract:

A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

US Patent:

6988535, Jan 24, 2006

Filed:

Oct 30, 2003

Appl. No.:

10/699505

Inventors:

Girish Upadhya - Mountain View CA, US
Richard Herms - Cupertino CA, US
Peng Zhou - Albany CA, US
Kenneth Goodson - Belmont CA, US

Assignee:

Cooligy, Inc. - Mountain View CA

International Classification:

F28F 7/00

US Classification:

165 804, 16510433, 16510421, 361699, 174 151, 257715

Abstract:

A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.

US Patent:

6994151, Feb 7, 2006

Filed:

Feb 12, 2003

Appl. No.:

10/366128

Inventors:

Peng Zhou - Albany CA, US
Kenneth Goodson - Belmont CA, US
Juan Suntiago - Fremont CA, US

Assignee:

Cooligy, Inc. - Mountain View CA

International Classification:

F28F 7/00

US Classification:

165 804, 16510421, 16510433, 16510426, 361700, 174 151, 257715

Abstract:

A vapor escape membrane for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device, the vapor escape membrane comprising: a porous surface for removing vapor produced from the liquid in the cooling region, the membrane configured to confine the liquid only within the cooling region. The vapor escape membrane transfers vapor to a vapor region within the heat exchanging device, wherein the membrane is configured to prevent liquid in the cooling region from entering the vapor region. The membrane is configured to include a hydrophobic surface between the membrane and the cooling region, wherein the liquid in the cooling region does not flow through the porous surface. The vapor escape membrane includes a plurality of apertures for allowing vapor to transfer therethrough, each of the apertures having a predetermined dimension.

US Patent:

7000684, Feb 21, 2006

Filed:

Oct 6, 2003

Appl. No.:

10/680584

Inventors:

Thomas W. Kenny - San Carlos CA, US
Mark Munch - Los Altos CA, US
Peng Zhou - Albany CA, US
James Gill Shook - Santa Cruz CA, US
Girish Upadhya - San Jose CA, US
Kenneth Goodson - Belmont CA, US
Dave Corbin - Los Altos CA, US
Mark McMaster - Palo Alto CA, US
James Lovette - San Francisco CA, US

Assignee:

Cooligy, Inc. - Mountain View CA

International Classification:

F28F 7/00

US Classification:

165 804, 16510421, 16510433, 361700, 174 151, 257715

Abstract:

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

US Patent:

7011793, Mar 14, 2006

Filed:

Mar 23, 2004

Appl. No.:

10/807051

Inventors:

Peng Zhou - Newtown PA, US
Lincoln Young - Ithaca NY, US

Assignee:

Kionix, Inc. - Ithaca NY

International Classification:

B01L 3/02
B01L 11/00
B01L 3/00
G01N 15/06
G01N 21/00

US Classification:

422100, 422 50, 422 55, 422 58, 422 681, 422 81, 422 82, 422 8205, 422101, 422102, 422103, 422104, 436 43, 436 52, 436 53, 436 63, 29592, 295921

Abstract:

A reconfigurable modular microfluidic system, providing a microfluidic breadboard platform for the formation of fluidic network and fluidic sealing upon a system assembly. Modular microfluidic elements or “chips” are arranged on a precisely machined alignment base to form a fluidic network, with fluid connections provided directly from chip-to-chip at overlapping corners. Fluidic access to external devices is possible at every fluid connection and through special ingress/egress chips. By maintaining a largely planar layout, optical access is provided for detecting or visualization for every chip. The assembly may be covered by a perforated cover plate.

US Patent:

7090001, Aug 15, 2006

Filed:

May 16, 2003

Appl. No.:

10/440363

Inventors:

Peng Zhou - Albany CA, US
Dolf van Der Heide - San Jose CA, US
Kenneth Goodson - Belmont CA, US
Girish Upadhya - San Jose CA, US

Assignee:

Cooligy, Inc. - Mountain View CA

International Classification:

F28D 15/00
F28F 7/00

US Classification:

16510421, 165 803, 16510433

Abstract:

A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled to the plate. A heat spreader can be in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.